Global PCB Connections: Following DFM Rules Leads to Better Boards
Elementary Mr. Watson: How to Reinvent Your Professional Journey
Fresh PCB Concepts: PCB Plating Process Overview
Ventec to Demo New Thermal Management Solutions, Laminates at IPC APEX EXPO 2018
February 12, 2018 | VentecEstimated reading time: 3 minutes
Thermal management and signal integrity will be the focus for Ventec International Group at this year’s IPC APEX EXPO show in San Diego (27th February – 1st March). On booth #818 the Ventec team will be on hand to demonstrate unique laminate & prepreg capability across a very wide range of applications and budgets. Show-highlights will feature the latest products from Ventec’s tec-thermal and tec-speed ranges as well as the launch of the much-anticipated micro eBook "The Printed Circuit Designer's Guide to... Thermal Management with Insulated Metal Substrates".
Ventec is further strengthening its position as a global leader in technology for high performance thermal management and signal integrity materials at the San Diego Convention Center on booth #818. Show-highlights include:
APEX EXPO debut: VT-5A2 Highest Performance Thermally Conductive Laminate Material
Ventec’s highest performance thermally conductive laminate material so far will make its APEX EXPO debut: VT-5A2 offers a polymer matrix that is fully compatible with Ventec laminates, epoxy or polyimide-based materials including tec-speed, making it the ideal choice for the manufacture of hybrid multilayer low-loss constructions. VT-5A2 sets itself apart by offering highest performance thermal conductivity 8 times that of FR4 at 2.2 W/m.K, a high Tg of 190°C, best in class thermal performance (T260 >60 Minutes, T288 >30 Minutes and T300 >15 Minutes) and MOT of 150°C. VT-5A2 is lead-free assembly compatible, fulfils RoHS and WEEE requirements and complies with UL94 V0.
tec-speed High-Speed/Low-Loss Materials
The tec speed brand unites one of the most comprehensive range of products in high speed/low loss PCB material technology. By using an ultra-low Dk material with Dk values between 2.3 and 2.8 lower losses, lower system power requirements and with it, the delicate balance of performance and cost can be achieved. Higher layer counts on backplanes, daughter cards and hand-held's are made possible in a smaller footprint by having smaller layer-to-layer separation without sacrificing trace width. Every tec speed product provides technological innovation, high performance and quality to customers to perfectly meet their needs.
Presenting Space and Aerospace PCB Material Capability
Ventec manufactures its polyimide and thin-core laminates using specially designed treaters with multiple stage filtration systems and 100% automated optical inspection (AOI) for prepreg FOD-control. Most recently Ventec was the first and only laminator to receive IPC-4101 Qualified Products Listing. The IPC's Validation Services program qualified VT-90H and VT-901 to specification sheet 41 of IPC-4101E (Specification for Base Materials for Rigid and Multilayer Printed Boards), putting Ventec in a market-leading position within the military, space and aerospace electronics supply chain.
VT-90H (UL-94 HB) and VT-901 (UL-94 V0) are exceptional material solutions for high reliability ML rigid and flex-rigid PCBs for use in thermally challenging environments, with high Td (VT-901=395, VT-90H=408), a Tg of 250oC and Low-Axis CTE (50). Both polyimide materials provide the extremely high reliability performance particularly demanded by military and aerospace as well as downhole drilling and similarly challenging applications.
Micro e-book promotion: "The Printed Circuit Designer's Guide to... Thermal Management with Insulated Metal Substrates"
Launched in time for IPC APEX EXPO, "The Printed Circuit Designer's Guide to... Thermal Management with Insulated Metal Substrates," by Ventec’s Didier Mauve and Ian Mayoh in collaboration with I Connect007, provides the PCB designer with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate (IMS) laminates, in order to select and specify the most appropriate material for a particular thermal management application, and to achieve a reliable and cost-effective design. A download link will be provided to booth-visitors for a free e-copy of the guide.
All these and more can be seen at the Ventec APEX EXPO booth #818.
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
Share on:
Suggested Items
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.
SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition
12/16/2024 | SCHMID GroupThe SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.
OKI Develops PCB Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer Space
12/12/2024 | BUSINESS WIREThe OKI Group printed circuit board (PCB) business company OKI Circuit Technology has successfully developed multilayer PCB technology with stepped copper coin insertion to achieve 55 times better heat dissipation compared to conventional PCB. The stepped copper coin is offered in two types, circular and rectangular, to suit the shape of the electronic component mounted on the PCB. OTC is working to develop mass-production technologies with the aim of introducing PCBs incorporating this new technology into markets for compact devices or devices used in outer space or other environments where air cooling technology cannot be used.
Fresh PCB Concepts: PCB Plating Process Overview
12/12/2024 | Team NCAB -- Column: Fresh PCB ConceptsIn this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as mechanical properties or size limitations of the alternatives, PCBs will remain the standard low-cost interconnection technology. Rapidly increasing performance and functionality requirements of wireless and high-speed devices have challenged the development and implementation of new manufacturing solutions.