-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueMechatronics
Our expert contributors discuss the advent of mechatronics in PCB design, the challenges and opportunities this creates for circuit board designers, and the benefits—to the employee and the company—of becoming a mechatronics engineer.
Creating a Culture of Collaboration
PCB designers could learn quite a bit from NASA and the private companies that develop spacecraft: Every one of these vehicles is a testament to the value of collaboration among disparate stakeholders. Without a collaborative culture, the rocket might never get off the ground.
Breaking High-speed Material Constraints
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems. Learn more in this issue.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Ventec to Demo New Thermal Management Solutions, Laminates at IPC APEX EXPO 2018
February 12, 2018 | VentecEstimated reading time: 3 minutes
Thermal management and signal integrity will be the focus for Ventec International Group at this year’s IPC APEX EXPO show in San Diego (27th February – 1st March). On booth #818 the Ventec team will be on hand to demonstrate unique laminate & prepreg capability across a very wide range of applications and budgets. Show-highlights will feature the latest products from Ventec’s tec-thermal and tec-speed ranges as well as the launch of the much-anticipated micro eBook "The Printed Circuit Designer's Guide to... Thermal Management with Insulated Metal Substrates".
Ventec is further strengthening its position as a global leader in technology for high performance thermal management and signal integrity materials at the San Diego Convention Center on booth #818. Show-highlights include:
APEX EXPO debut: VT-5A2 Highest Performance Thermally Conductive Laminate Material
Ventec’s highest performance thermally conductive laminate material so far will make its APEX EXPO debut: VT-5A2 offers a polymer matrix that is fully compatible with Ventec laminates, epoxy or polyimide-based materials including tec-speed, making it the ideal choice for the manufacture of hybrid multilayer low-loss constructions. VT-5A2 sets itself apart by offering highest performance thermal conductivity 8 times that of FR4 at 2.2 W/m.K, a high Tg of 190°C, best in class thermal performance (T260 >60 Minutes, T288 >30 Minutes and T300 >15 Minutes) and MOT of 150°C. VT-5A2 is lead-free assembly compatible, fulfils RoHS and WEEE requirements and complies with UL94 V0.
tec-speed High-Speed/Low-Loss Materials
The tec speed brand unites one of the most comprehensive range of products in high speed/low loss PCB material technology. By using an ultra-low Dk material with Dk values between 2.3 and 2.8 lower losses, lower system power requirements and with it, the delicate balance of performance and cost can be achieved. Higher layer counts on backplanes, daughter cards and hand-held's are made possible in a smaller footprint by having smaller layer-to-layer separation without sacrificing trace width. Every tec speed product provides technological innovation, high performance and quality to customers to perfectly meet their needs.
Presenting Space and Aerospace PCB Material Capability
Ventec manufactures its polyimide and thin-core laminates using specially designed treaters with multiple stage filtration systems and 100% automated optical inspection (AOI) for prepreg FOD-control. Most recently Ventec was the first and only laminator to receive IPC-4101 Qualified Products Listing. The IPC's Validation Services program qualified VT-90H and VT-901 to specification sheet 41 of IPC-4101E (Specification for Base Materials for Rigid and Multilayer Printed Boards), putting Ventec in a market-leading position within the military, space and aerospace electronics supply chain.
VT-90H (UL-94 HB) and VT-901 (UL-94 V0) are exceptional material solutions for high reliability ML rigid and flex-rigid PCBs for use in thermally challenging environments, with high Td (VT-901=395, VT-90H=408), a Tg of 250oC and Low-Axis CTE (50). Both polyimide materials provide the extremely high reliability performance particularly demanded by military and aerospace as well as downhole drilling and similarly challenging applications.
Micro e-book promotion: "The Printed Circuit Designer's Guide to... Thermal Management with Insulated Metal Substrates"
Launched in time for IPC APEX EXPO, "The Printed Circuit Designer's Guide to... Thermal Management with Insulated Metal Substrates," by Ventec’s Didier Mauve and Ian Mayoh in collaboration with I Connect007, provides the PCB designer with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate (IMS) laminates, in order to select and specify the most appropriate material for a particular thermal management application, and to achieve a reliable and cost-effective design. A download link will be provided to booth-visitors for a free e-copy of the guide.
All these and more can be seen at the Ventec APEX EXPO booth #818.
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
Suggested Items
Trouble in Your Tank: Materials for PWB Fabrication—Drillability and Metallization
07/16/2024 | Michael Carano -- Column: Trouble in Your TankLaminate materials are the building blocks on which printed circuit boards are manufactured. Circuit board designers rely on the critical electrical properties of the materials to design the interconnects, and with the drive toward IoT (internet of things), autonomous driving, and virtual and augmented reality, material properties take on a very high level of importance.
Beyond Prepreg: The Glassless ‘Revolution’
06/25/2024 | Marcy LaRont, PCB007 MagazineAs our industry rallies around the call to action for HDI and UHDI, we find unparalleled and myriad laminate options. This abundance is rivaled only by the question surrounding them: Can they measure up to the high technology packaging demands required in our near future? Unsurprisingly, recent developments in FR-4-esque materials for high-speed and high-density designs, as well as newer, glassless technology for replacing traditional glass-impregnated laminates and prepreg, are garnering much interest. I caught up with Alun Morgan, technology ambassador for Ventec International Group, to ask about the impending “glassless revolution” and how it’s poised to solve some of our manufacturing challenges.
Connect the Dots: Designing for Reality—Lamination and Materials
06/19/2024 | Matt Stevenson -- Column: Connect the DotsAs many of you have likely figured out, I am quite passionate about the subject of designing PCBs for the reality of manufacturing. I wrote a book about it and I participate in an I-Connect007 On the Line with… podcast series dedicated to the subject. This companion article will focus on multilayer lamination, keeping the bigger picture in mind: Realistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. So, one must account for the production variables associated with individual manufacturing partners.
Day 2: A Full Day at the EIPC Summer Conference
06/19/2024 | Pete Starkey, I-Connect007Editor's note: This is the third and final report from the EIPC Summer Conference. It was a bright and early start to the second day of the 2024 EIPC Summer Conference at the European Space Centre, Noordwijk, The Netherlands, June 4-5. A short journey by bus from the hotel in Leiden and our security passes from the day before got us through the gate and to our seats in the Newton Room for Session 4, “Material Studies,” moderated by Martyn Gaudion.
Looking Into Space: EIPC Summer Conference, Part 2
06/17/2024 | Pete Starkey, I-Connect007“Innovative Development of PCB Technology and Design” was the theme of the second session of the 2024 EIPC Summer Conference, June 4-5, at the European Space Centre, Noordwijk, The Netherlands.