Beyond Design: The Fundamental Structure of Spectral Integrity
Elementary, Mr. Watson: High Power: When Physics Becomes Real
The Shaughnessy Report: Watt About Power Integrity?
I-Connect007 Launches Thermal Management with Insulated Metal Substrates eBook
February 13, 2018 | I-Connect007Estimated reading time: 1 minute
I-Connect007 is excited to announce the release of the latest title in our micro eBook design series: The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates.
The Printed Circuit Designer’s Guide to… is an ongoing book series specifically dedicated to educating PCB designers, and serves as a valuable resource for people seeking the most relevant design information available.
Considering thermal issues in the earliest stages of the design process is critical. Written by Didier Mauve, sales and marketing manager at Ventec International Group, and Ian Mayoh, technical support manager, this book highlights the need to dissipate heat from electronic devices.
The authors provide essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates. The book also aims to aid PCB designers in the selection and specification of materials for particular applications, which will contribute to more reliable and cost-effective designs.
Alun Morgan, Chairman at EIPC, describes the book as, "A comprehensive tour through the world of thermal management. Required reading for designers and end users wishing to understand the science and practice of using insulated metal substrate materials."
Readers will develop a comprehensive awareness of the physical realities of insulated metal substrates and their applications in the thermal management of electronic assemblies.
Download your free copy today at I-007eBooks.com/TM! You can also view our full library at I-007eBooks.com.
Look for these other exciting titles in The Printed Circuit Designer’s Guide to… series:
- Fundamentals of RF/Microwave PCBs and Flex and Rigid-Flex Fundamentals by American Standard Circuits
- Power Integrity and Signal Integrity by Example by Mentor, A Siemens Business
- Secrets of High-Speed PCBs — Parts 1 & 2 by Polar Instruments
- Design for Manufacturing (DFM) by Altium
…and these upcoming releases:
- Executing Complex PCBs by Freedom CAD
- Documentation by DownStream Technologies
We hope you enjoy The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates.
For more information, contact:
Barb Hockaday
I-Connect007 eBooks
barb@iconnect007.com+1-916-365-1727 (GMT-8)
+1-916-365-1727 (GMT-8)
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Peters, Starteam, and Würth Elektronik Team Up For Digital Coating Technology
10/23/2025 | PetersUnder this heading, the PCB manufacturers Starteam and Würth Elektronik, along with Peters as inkjet coating supplier, have taken the initiative and worked together for months in trusting and target-oriented cooperation, to promote this innovative digital coating technology for solder resists and establish it on the market.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.
SEMICON Japan 2025 to Spotlight Sustainability in AI and Semiconductor Innovation
10/22/2025 | SEMISEMICON Japan 2025, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will bring together more than 1,200 exhibitors showcasing semiconductor solutions from December 17-19 at Tokyo Big Sight.
Zuken Announces ZIW Americas 2026 in Dallas
10/21/2025 | ZukenZuken USA, Inc., a global leader in electrical and electronic design automation, announced Zuken Innovation World (ZIW) Americas 2026, the company’s premier global conference dedicated to advancing the future of electrical and electronic product design. ZIW 2026 will be held June 9-11 in Dallas, Texas.
Keysight Completes Acquisition of Synopsys’ Optical Solutions Group and Ansys’ PowerArtist
10/17/2025 | Keysight Technologies, Inc.Keysight Technologies, Inc., announced the completion of its acquisitions of the Optical Solutions Group from Synopsys, Inc., and PowerArtist from Ansys, Inc.