Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Saki to Demonstrate AOI, SPI, and AXI Software and Systems at IPC APEX EXPO Booth 1127
February 26, 2018 | Saki CorporationEstimated reading time: 1 minute
Saki Corporation will demonstrate its new 5th generation, 3D Automated Optical Inspection (AOI), 3D Solder Paste Inspection (SPI), and 3D Automated X-ray Inspection (AXI) systems and software at the IPC APEX EXPO, February 27-March 1, San Diego, California, Booth 1127. In addition, Saki's 3D AOI system, based on its Quality-Driven Production (QDP) concept for true closed-loop, machine-to-machine communication, will be part of the Fuji SMART Factory Line in booth 3539.
Saki's 3D AOI and SPI systems are the fastest and most accurate 3D inspection and measurement systems in the world, while maintaining position accuracy of 3μm to 9μm at 3σ for 99.7% positioning accuracy. These systems are the first to offer a choice of three resolutions-7μm, 12μm, and 18μm. They can inspect and measure all components, from the very smallest to components 20mm in height, come in both single and dual lanes, and handle all size boards.
For AXI, Saki's 3D BF-3 AXI system is the most accurate 3D AXI system available, achieving 100% head-in-pillow detection and enabling land grid array (LGA) inspection and measurement. It inspects for voids inside the solder joints of insulated gate bipolar transistor (IGBT) modules, which is especially important in the automotive industry.
Quality-Driven Production, Saki's tool for M2M communication, ensures that the data and information that is communicated to third party systems is valid and accurate. A self-diagnostic system with predictive and preventive maintenance management assures stable machine conditions and repeatable, consistent performance. Every key component is monitored, along with system conditions, and a detailed diagnostic log is recorded. Process stability is improved, productivity increased, and equipment operating costs reduced.
"We are excited to be exhibiting at IPC APEX this year," said Satoshi Otake, General Manager, SAKI Americas. "In addition to our new systems, Saki is unveiling and giving demonstrations of our totally new software system. We hope you will come to our booth and give it a try."
About Saki
Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology. Saki's 3D automated solder paste, optical, and x-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. Saki Corporation has headquarters in Tokyo, Japan with offices, sales, and support centers around the world.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.