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This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
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RTW IPC APEX EXPO: Valor Tool Benefits from Merging Mentor, Siemens Technologies
February 28, 2018 | Real Time with...IPCEstimated reading time: Less than a minute
Oren Manor, director of business development, discusses the convergence of the electrical and mechanical disciplines made possible through Mentor's merger with Siemens. Manor also explains how Mentor's Valor platform now utilizes Siemens' "digital twin" concept.
To watch this interview, click here.
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Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
11/22/2024 | SIAThe Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
Foxconn to Build AI Factories with NVIDIA Omniverse Platform
11/20/2024 | FoxconnFoxconn announced it is collaborating with NVIDIA to build digital twins to reshape the future of manufacturing processes and supply chain management while opening new pathways for global deployment of advanced facilities and enhancing corporate resilience.
CHIPS for America Announces New Proposed $285 Million Award for CHIPS Manufacturing USA Institute for Digital Twins
11/19/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Department to provide SRC $285 million to establish and operate a Manufacturing USA institute headquartered in Durham, North Carolina.