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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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RTW IPC APEX EXPO: Uyemura's Chemistry for ENIG, ENEPIG, and EPIG Apps
March 12, 2018 | Real Time with...IPCEstimated reading time: Less than a minute

Richard DePoto of Uyemura discusses a unique deposition chemistry that combines immersion and reduction reactions to yield a gold finish with superior properties and controllability in ENIG, ENEPIG, and EPIG applications.
To watch the interview, click here.
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