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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Qnity Advances Interconnect Innovations for Next-Generation Smart Consumer Electronics

10/22/2026 | Qnity
Qnity Electronics, Inc. introduces ultra-thin flex circuit materials that help enable the next generation of smart consumer electronics, including smartphones, AI glasses, and AR/VR devices, through advanced materials innovations that deliver exceptional bendability, mechanical performance, and reliability for advanced interconnect applications.

Arda Emerges from Stealth to Speed Up American Manufacturing

10/21/2026 | BUSINESS WIRE
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Siemens, NVIDIA Expand Agentic AI Collaboration for 3D IC Power and Thermal Design

10/21/2026 | Siemens
Siemens announced an expansion of its EDA agentic AI portfolio, developed in collaboration with NVIDIA.

Cadence InnoStack AI Agent Supports Socionext’s 3nm SoC Design

10/21/2026 | Cadence Design Systems
 Socionext Inc., a global leader in custom SoC design and development, is actively advancing its SoC design and development capabilities through agentic AI and expanding the application of AI-driven design to the physical design of large-scale system-on-chip (SoCs) using advanced process technologies.

From IPC Standards to Practical DFM

10/21/2026 | Marcy LaRont, I-Connect007
DFM seems like common sense: If we know the rules a PCB must meet, why not check the design against them before it ever reaches the factory? In practice, of course, it’s not quite that simple. I caught up with Susan Kayesar, product manager at Siemens and longtime contributor to Global Electronics Association standards activities, to talk about an ongoing effort between Siemens and the Association to translate IPC requirements into practical, software-based DFM checks.
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