Beyond Design: Slaying Signal Integrity Villains
Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
New Show & Tell Magazine: Complete Coverage of IPC APEX EXPO
March 19, 2018 | I-Connect007Estimated reading time: 1 minute
I-Connect007 is proud to announce the release of our first edition issue of Show & Tell, the magazine dedicated to covering the events of IPC APEX EXPO 2018 in San Diego, California.
Through interviews, photography, and other exclusive content, I-Connect007 has been instrumental in bringing the industry’s most important trade shows to our global reader community for over 15 years.
This year, we decided to launch the most comprehensive event coverage the industry has ever seen! This digital magazine is part of the premium content library available for my I-Connect007 members, which also includes our popular I-007eBook series.
Show & Tell is packed with complete coverage of IPC APEX EXPO 2018. Inside you will find great show photos, Real Time with… IPC APEX EXPO 2018 video highlights, and other featured content, including: exclusive interviews with the IPC Hall of Fame Inductee and other IPC Award Winners, results of the I-Connect007 Student Photo Contest, insights from our Q&A with attendees and industry professionals, and expert opinions from our columnists.
“This magazine allows our readers, both those who were there and those who were not, to experience IPC APEX EXPO 2018 and hear from the voices of our industry,” says Barry Matties, I-Connect007 publisher.
Click here to preview Show & Tell and download your free copy today! Either log in to your my I-Connect007 account or register to become a member to access our premium content library.
We hope you enjoy Show & Tell!
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Technica USA Advocates for PCBAA Membership Among Printed Circuit Assembly Customers
09/16/2025 | Technica USATechnica USA is actively encouraging its printed circuit assembly customers to join the Printed Circuit Board Association of America (PCBAA), a leading industry organization advocating for increased domestic production of printed circuit boards (PCBs) and substrates.
Marcy’s Musings: Advancing the Advanced Materials Discussion
09/17/2025 | Marcy LaRont -- Column: Marcy's MusingsAs the industry’s most trusted global source of original content about the electronics supply chain, we continually ask you about your concerns, what you care about, and what you most want to learn about. Your responses are insightful and valuable. Thank you for caring enough to provide useful feedback and engage in dialogue.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.