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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Eurocircuits Expands Service Offerings
March 20, 2018 | EurocircuitsEstimated reading time: 1 minute
Electronics designers and the production side have always locked heads: the designers want to make everything smaller and smaller and more cost effective; unfortunately, this is sometimes counterproductive to both the PCB manufacturers and assemblers. This always results in a compromise on both sides, often affecting the quality and electrical stability of the boards.
One such issue that often arises is finding a suitable solution to utilizing the pad as a through-hole connector without causing production and quality issues with solder wicking away through the via and causing insufficient, unstable, or even unsoldered joints.
To address this issue, Eurocircuits is now offering a via filling and conductive capping service to enable designers to increase board density without reducing reliability.
For more information, click here.
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