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Rogers Launches Low-Loss Laminates, Bonding Materials, and Foils
March 28, 2018 | Rogers CorporationEstimated reading time: 2 minutes
Rogers Corporation has introduced a set of next-generation products designed to meet the existing and emerging needs of advanced millimeter wave multilayer designs.
RO4835T laminates, offered in a 2.5 mil, 3 mil and 4 mil core thickness, are 3.3 Dk, low-loss, spread glass reinforced, ceramic filled thermoset materials designed for inner-layer use in multilayer board designs, and complement RO4835 laminates when thinner cores are needed. Secondly, RO4450T™ Bonding Materials are 3.2-3.3 Dk, low loss, spread glass reinforced, ceramic filled bonding materials that were designed to complement RO4835T and the existing RO4000® laminate family, and come in 3 mil, 4 mil or 5 mil thicknesses. Lastly, CU4000 and CU4000 LoPro Foils are sheeted foil options for designers looking for foil lamination builds, and provide good outer layer adhesion when used with RO4000 products.
RO4835T laminates and RO4450T bonding materials exhibits excellent Dk control for repeatable electrical performance, a low z axis expansion for plated through hole reliability, and are compatible with standard epoxy/glass (FR-4) processes. These materials are an excellent choice for multilayer designs requiring sequential laminations, as fully cured RO4000 products are capable of withstanding multiple lamination cycles. RO4835T laminate and RO4450T bondply have the UL 94 V-0 flame retardant rating, and are compatible with lead-free processes.
About Rogers Corporation
Rogers Corporation is a global leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, internet connectivity, and safety and protection applications, as well as other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification and alternative energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, click here.
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Julia McCaffrey - NCAB GroupSuggested Items
Ventec Evaluates US Manufacturing Facility to Support North American Growth
04/28/2026 | Ventec International GroupVentec International Group today announced that it is evaluating the potential establishment of a manufacturing facility in the United States to support its growing North American customer base with high-performance laminate and prepreg materials.
Roundtable: Advanced Materials
04/27/2026 | I-Connect007 Editorial TeamDriven largely by the need for advanced chip technology for super compute ability and AI applications, low Dk, low-loss resin systems, and heavy copper laminate are attracting significant attention and global resources. There are numerous unavoidable challenges in this market that will impact manufacturers and the supply chain, and they may be hitting critical mass sooner than OEMs and fabricators think. In this roundtable discussion, moderator Marcy LaRont speaks with topic experts: Mark Goodwin, John Fix, and Ed Kelley.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Volatile Metals Market Creates PCB Pricing Headache
04/20/2026 | Nolan Johnson, I-Connect007Market volatility for precious metals is very real. Financial organizations have reported elevated volatility, with record highs and steep corrections; in 2025 alone, gold has increased by over 60%, silver over 120%, and copper over 35%. Each is a critical raw material used in electronics manufacturing, where pricing is already fraught for business owners and their customers due to tariff uncertainty and a critical supply chain that resides mostly in China. The volatility of precious metals markets adds yet another layer of complexity for manufacturers, pushing up raw material costs.
I-Connect007 Releases Episode 4 of ‘PCB Materials: The Backbone and Future of Electronics’ Podcast Series
04/09/2026 | I-Connect007I-Connect007 is excited to announce the release of Episode 4 in its six-part podcast series with Isola experts, PCB Materials: The Backbone and Future of Electronics. Titled “Reliability Under Pressure—PCBs in Harsh Environments,” this episode explores the challenges of maintaining long-term performance in demanding applications like aerospace, automotive, and defense. Host Marcy LaRont speaks with Laura Martin, director of strategic markets at Isola, about what reliability truly means when printed circuit boards are pushed to their limits.