Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
The Chemical Connection: Through-glass Vias in Glass Substrates
Rogers Introduces New Laminates for Base Station Antenna Applications
April 4, 2018 | Rogers CorporationEstimated reading time: 1 minute
Rogers Corporation has introduced two new products: AD300D laminates and IM Series laminates. AD300D fourth generation, commercial microwave and RF laminate material extends the capabilities of the successful AD300 product grade.
This ceramic-filled, glass-reinforced, PTFE based material provides the controlled dielectric constant (2.94±0.05), low loss performance (0.0021 at 10GHz), very good passive intermodulation response (-159dBc at 0.030” thickness), and good circuit process ability required for mobile infrastructure microstrip antenna applications. This PTFE composite material combines a cost-effective construction with unique chemistry and processing to offer RF and microwave designers an option for improving electrical and mechanical performance without the additional costs traditionally associated with higher performance material options.
The IM Series high-frequency laminates are an outstanding passive intermodulation (PIM) performing version of our AD300D, AD255C, and DiClad 880 antenna grade laminates. The laminates now include the newly developed IM system option. This product utilizes an ultra-smooth (Rq = 0.5µm by non-contact interferometry method) electrodeposited copper foil option which has excellent adhesion to the substrate materials. The PIM performance of all substrates with the IM cladding has typical values of -166dBc at 0.030” and -165dBc at -060” using the Rogers internal test method of two 43 dBm swept tones at 1900 MHz. These specialty materials are specifically engineered and manufactured to meet the demands of today’s base station antenna markets.
About Rogers Corporation
Rogers Corporation is a global technology leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, Internet connectivity, advanced transportation and other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification, and alternative energy; Elastomeric Material Solutions for sealing, vibration management, and impact protection in mobile devices, transportation interiors, and performance apparel; and Advanced Connectivity Solutions materials for wireless infrastructure, automotive safety and radar systems. Headquartered in Chandler, Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, click here.
Share on:
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.