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Rogers Introduces New Laminates for Base Station Antenna Applications
April 4, 2018 | Rogers CorporationEstimated reading time: 2 minutes
Rogers Corporation has introduced two new products: AD300D laminates and IM Series laminates. AD300D fourth generation, commercial microwave and RF laminate material extends the capabilities of the successful AD300 product grade.
This ceramic-filled, glass-reinforced, PTFE based material provides the controlled dielectric constant (2.94±0.05), low loss performance (0.0021 at 10GHz), very good passive intermodulation response (-159dBc at 0.030” thickness), and good circuit process ability required for mobile infrastructure microstrip antenna applications. This PTFE composite material combines a cost-effective construction with unique chemistry and processing to offer RF and microwave designers an option for improving electrical and mechanical performance without the additional costs traditionally associated with higher performance material options.
The IM Series high-frequency laminates are an outstanding passive intermodulation (PIM) performing version of our AD300D, AD255C, and DiClad 880 antenna grade laminates. The laminates now include the newly developed IM system option. This product utilizes an ultra-smooth (Rq = 0.5µm by non-contact interferometry method) electrodeposited copper foil option which has excellent adhesion to the substrate materials. The PIM performance of all substrates with the IM cladding has typical values of -166dBc at 0.030” and -165dBc at -060” using the Rogers internal test method of two 43 dBm swept tones at 1900 MHz. These specialty materials are specifically engineered and manufactured to meet the demands of today’s base station antenna markets.
About Rogers Corporation
Rogers Corporation is a global technology leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, Internet connectivity, advanced transportation and other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification, and alternative energy; Elastomeric Material Solutions for sealing, vibration management, and impact protection in mobile devices, transportation interiors, and performance apparel; and Advanced Connectivity Solutions materials for wireless infrastructure, automotive safety and radar systems. Headquartered in Chandler, Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, click here.
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ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
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