-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Mentor’s HyperLynx Automates SERDES Channel Design
April 9, 2018 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
Mentor recently released the newest version of its HyperLynx signal integrity software. This version may be the first SI tool in the industry to fully automate SERDES design channel validation. I spoke recently with Chuck Ferry, product marketing manager with Mentor, about the new HyperLynx and some of the new serial link design capabilities that customers have been demanding.
Andy Shaughnessy: Some of the newer HyperLynx capabilities are focused on the users’ SERDES design challenges. Part of the problem with SERDES seems to be that the standards for SERDES have been playing catch-up for a while, according to quite a few design engineers. What do you see going on in the SERDES standards space?
Chuck Ferry: SERDES-related standards have been evolving very quickly. The number of protocols for high-speed serial data has increased drastically in the last few years. Often with each new generation of protocol, the data rates are doubling. Some of the challenges hardware designers face with the recent protocols are related to differences in the types of analysis that are required and the results they must understand to properly determine if a interface will pass or fail the requirements for that given protocol. For example, the new standards rely on new metrics such as channel operating margin (COM) to determine the pass or fail criteria of the interconnect.
Shaughnessy: What does it take to validate high-speed serial interface from chip-to-chip in a large system? It seems that it would be a real issue with a data center or cellular base station.
Ferry: To validate a high-speed serial link end-to-end per modern protocol every aspect of the signal interconnect between the chips must be modeled accurately including the IC packages, trace interconnect, as well as the characteristics of the drivers and receivers, including complex equalization schemes and optimization capabilities associated with those.
Shaughnessy: What questions are you hearing from hardware designers who are tackling these types of designs?
Ferry: The latest version of HyperLynx's new capabilities provides solutions to system-level designers with hard questions along these lines. They’re wondering, “Are my implementations possible with various physical constraints and selected board materials? What if I don't have models for my driver or don't know what driver will be, but I just know the standard that it needs to comply to? How can I quickly validate an interface with this specific protocol standard? How can I model this long interconnect channel with 3D features in a reasonable amount of time? How can I find problems in my channel design before it's actually full routed?”
To read this entire article, which appeared in the March 2018 issue of Design007 Magazine, click here.
Visit I-007eBooks to download your copies of Mentor's micro eBooks today:
The Printed Circuit Designer’s Guide to…Signal Integrity by Example
The Printed Circuit Designer’s Guide to…Power Integrity by Example
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.