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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Mentor Announces New On-Demand Webinar
April 17, 2018 | Mentor GraphicsEstimated reading time: Less than a minute
Why should PCB designers consider testability in their designs? Because the existing approach to DFT is too reactive.
Testability considerations occur too late in the design cycle, resulting in defects that slip by undetected or require an expensive functional test to catch. This reactive approach leads to reduced quality, scrapped boards, and increased costs—which means that product targets are missed, business plans are not met, and bonuses are not paid.
To help designers take a more proactive approach to testability, Mentor, A Siemens Business, has announced an on-demand webinar that provides specific steps they can take to build proactive testability strategies.
For more information, click here.
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The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
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