Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
SMTA Europe: Electronics in Harsh Environments Conference, Session 6
April 18, 2018 | SMTAEstimated reading time: 1 minute
SMTA Europe announces Session 6, Technical Program on Automotive Electronics at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25, 2018.
Electronic products may be subjected to thermal excursions resulting from the power on/off cycling and changes in the environment temperature. The board geometry and architecture can affect the thermal-mechanical reliability of the PCB materials. Dr. Eric Cotts from Binghamton University will present on PCB Materials and Fabrication. Dr. Cotts will share his thoughts on designing for excellence.
The plastic package that houses integrated circuits can degrade when exposed to high temperatures. Erik Spory of Global Circuit Innovations will present on a hermetic ceramic package design that provides a die pad surface for applications up to 250°C without connectivity degradation. Mr. Spory will also reference this technology option for use into other applications which expose IC to harsh environments.
With technology thrusts into automotive and aviation, electronics need to be designed to operate reliably at temperatures between 150°C and 175°C. Dr. Craig Hillman of DfR Solutions will present on insights and tradeoffs in designing passives, crystals, magnetics, discretes, integrated circuits, connectors, PCBs and solders to operate reliability within high temperature environments. Dr. Hillman will show how Point of Failure models can be sued to understand the risks of high temperature environments over time and how to effectively mitigate those risks through circuit design, derating and material selection.
Share on:
Suggested Items
Wolfspeed Stock Soars After Filing for Chapter 11 Bankruptcy
07/01/2025 | I-Connect007 Editorial TeamOn July 1, Wolfspeed shares doubled following the company’s announcement on June 30 that it had filed for Chapter 11 bankruptcy protection.
Zollner Completes Full Acquisition of Bluechips Microhouse
07/01/2025 | Zollner Elektronik AGZollner Elektronik AG has successfully finalized its com- plete takeover of Bluechips Microhouse Co., Ltd., in Thailand. In the future the company will operate as part of the Zollner Group of companies under the leadership of Thomas Kiefl – strategically networked, technologically focused and internationally oriented.
Inission Acquires the Lithuanian Company Selteka
07/01/2025 | InissionInission AB has signed an agreement to acquire 100% of UAB Selteka. Selteka is a well-respected EMS (electronics manufacturing services) company with operations located in Kaunas, Lithuania.
RTX, Shield AI Partner to Develop New Defense Capabilities
07/01/2025 | RTXRTX and Shield AI announced a new partnership to integrate Shield AI capabilities into select RTX defense products, like loitering munitions and sensors. This collaboration will deliver enhanced, autonomous capabilities to US and allied defense forces.
Lockheed Martin Completes Acquisition of Amentum’s Rapid Solutions Portfolio
07/01/2025 | Lockheed MartinLockheed Martin has closed its acquisition of the Rapid Solutions business of Amentum, an engineering and technology solutions company.