Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
The Chemical Connection: Through-glass Vias in Glass Substrates
Atotech to Demo Flex/Flex-Rigid Products at KPCA 2018
April 23, 2018 | AtotechEstimated reading time: 1 minute
At the KPCA Show 2018, held in Gyeonggi-do from April 24 to 26, Atotech will showcase its latest production solutions for flex/flex-rigid and other PCB types at booth number J201. Next to its product promotion at the trade show booth, the company takes part in the technical conference (hall 7, Kintex 2) with the presentation of two papers.
On Wednesday, April 25, from 3:00 to 4:00 pm, Frank Bruening, Global Business Manager for desmear and metallization at Atotech Deutschland GmbH, will present Printoganth RA, Atotech’s novel electroless copper process for high-end flex and flex-rigid PCBs on super flexible RA copper foil. The presentation will be held in room 1 in exhibition hall 7, Kintex 2.
On Thursday, April 26, from 1:30 to 2:30 pm, Sukyoung Kim, Sales and Product Marketing Manager Atotech Korea Ltd., will present InPro SAP3, a process which allows for excellent within-unit distribution at high current density. Visitors can follow his presentation in room 1, Exhibition Hall 7, Kintex 2.
Printoganth RA
Printoganth RA is a horizontal electroless copper process for next generation flex and rigid-flex PCBs. The process enables a uniform electrolytic copper deposition with a shiny surface appearance for reliable automated optical inspection (AOI). Due to constant, low tensile internal stress, it provides blister-free coverage and excellent adhesion on polyimide surfaces.
InPro SAP3
InPro SAP3 is a DC copper plating electrolyte for IC Substrate BMV filling. It uses insoluble anodes in vertical conveyorized systems (VCP). The process offers reliable via filling results and achieves excellent within-unit distribution at high current densities.
For further questions on these or other products, visitors to the show are invited to join Atotech’s paper presentations or pass by the Atotech booth number J201 during the KPCA Show from April 24 to 26. Local and international specialists will be on site to discuss any question or inquiry.
About Atotech
Atotech is one of the world’s leading manufacturers of specialty chemicals and equipment for the printed circuit board, IC-substrate and semiconductor industries, as well as for the decorative and functional surface finishing industries. Atotech has annual sales of USD1.2 billion (2017). The company is fully committed to sustainability – we develop technologies to minimize waste and to reduce environmental impact. Atotech has its headquarters in Berlin, Germany, and employs about 4,000 people in over 40 countries. About a quarter of all staff works in one of the four locations in Germany: Berlin, Feucht, Neuruppin, and Trebur. For more information, click here.
Share on:
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.