-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Dr. John Ganjei to Retire from MacDermid Enthone
April 27, 2018 | MacDermid Enthone Electronics SolutionsEstimated reading time: 2 minutes
Dr. John Ganjei, advanced technology manager for the MEES Electronics Materials group, has decided to retire from MacDermid Enthone at the end of April.
John graduated from Cornell University earning his PhD in Analytical Chemistry. He started his career at the US Naval Research Lab in Washington, DC. He later joined ICI followed by Hercules where he gained valuable technical expertise in dryfilm photoresists.
John then became part of the MacDermid organization upon the acquisition of the photoresist business from Hercules. While working at MacDermid, as Global Director of Electronic Specialties, John spearheaded many successful programs in dryfilm, liquid imaging and MultiBond innerlayer bonding technologies. Most recently, John held the position of Advanced Technology Manager for the Electronics Materials group where he implemented a successful strategy to penetrate the semiconductor packaging market with products designed to achieve improved package reliability.
John is well known and respected within the electronics industry. He holds numerous patents and has been active in many industry trade organizations including IPC, SMTA, IEEE, and HDPUG where he has written and presented papers and participated in committees writing industry specification. We congratulate John and wish him a long and happy retirement.
Bruce Lee will be John’s successor and take on the position of Technology Manager for Electronics Materials. Bruce came to MacDermid Enthone in 2005 as a Specifications Manager for our OEM & Assembly Applications team. He used his extensive experience in PCB fabrication to gain specifications from end users and tier 1s. For the last 8+ years he served as Applications Manager for the photovoltaics strategic initiative, where he gained expertise, identified portfolio gaps, and guided new product development. In addition to his new position, Bruce will continue to engage in photovoltaic projects. He will also take on responsibilities in electronics packaging, molded interconnects devices, LED and other projects within the purview of Electronics Materials.
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. For more information, click here.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/15/2026 | Nolan Johnson, I-Connect007When you work in the news business, even in trade media, you can never really get that far away from it. We never want to miss something important. Chances are, even the books we take on our “vacations” end up having to do with the business. For example, my colleague Michelle Te recommended “Creativity, Inc., by Ed Catmull, a business skills study wrapped up in stories about Pixar, which I brought with me on a trip through the stunning U.S. Mountain West. Now, I’m back, and here are my recommendations for the week.
Incap India Invests in Testing and SMT Upgrades to Scale Production
05/15/2026 | IncapIncap India has completed the installation of a new flying probe test system and a full SMT (Surface-Mount Technology) line upgrade at its Tumkur factory.
Interlink Electronics Reports Q1 2026 Results
05/15/2026 | Globe NewswireRevenue for the first quarter of 2026 increased 15% to $3.07 million, compared to $2.66 million in the first quarter of 2025. The increase was driven by higher shipments of the Company’s force-sensing and printed electronics products, partially offset by lower sales of its gas‑sensor products.
New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability
05/14/2026 | I-Connect007I-Connect007 proudly announces the recent release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new volume offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.
Nortech Systems Reports Q1 Results
05/14/2026 | Globe NewswireNortech Systems Incorporated, a leading provider of engineering and manufacturing solutions for complex electromedical and electromechanical products serving the medical imaging, medical device, industrial, and aerospace & defense markets, reported financial results for the first quarter ended March 31, 2026.