Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
Global PCB Connections: The Next Wave of HDI PCBs– How Design Engineers Can Stay Ahead
Now Available: The May 2018 Edition of PCB007 Magazine
May 9, 2018 | I-Connect007Estimated reading time: Less than a minute
“Connecting at the Speed of 5G” is the topic for the May edition of PCB007 Magazine, which has published and is now available for download.
What truly defines 5G, as compared to 4G and 3G? As the children say on road trips, "Are we there yet?" Find out what is here, and what’s on the horizon for the industry and the world when it comes to the dawn of the 5G era.
Check it all out this month in PCB007 Magazine, now on the virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.
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