Beyond Design: The Fundamental Structure of Spectral Integrity
Elementary, Mr. Watson: High Power: When Physics Becomes Real
The Shaughnessy Report: Watt About Power Integrity?
Deadline Approaching for Abstract Submission
May 16, 2018 | IPCEstimated reading time: Less than a minute
The deadline is fast approaching for the submission of technical paper for the electronics industry’s premier technical conferences and exhibition, or provide a course proposal for the largest educational event in North America.
Presenting at IPC APEX EXPO provides visibility for you and your organization. Thousands of individuals receive the technical proceedings from this event, ensuring that your material will be seen by key managers and executives from all segments of the worldwide electronics industry. Staff from companies such as Ericsson, Flex, IBM, Indium, MacDermid-Enthone, Northrop Grumman, Oracle and Robert Bosch have presented papers at past technical conference sessions at IPC APEX EXPO. To recognize exceptional achievement, awards will be presented for "Best Paper."
Submissions are being sought on design, materials, assembly, processes and equipment in areas from advanced technology to underfills and via plugging.
The abstracts and course proposals are due June 15, 2018. For more information topics, speaker benefits and speaker recognition awards, please visit www.ipcapexexpo.org/cfp.
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