Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
The Shaughnessy Report: Breaking Down the Language Barrier
Connect the Dots: Designing for Reality—Routing, Final Fab, and QC
May Issue of Design007 Magazine Available Now
May 16, 2018 | Andy Shaughnessy, Design007 MagazineEstimated reading time: Less than a minute
“5G: Coming to Your World Soon” is the topic for the May edition of Design007 Magazine, which has published and is now available for download.
We’ve all heard plenty about 5G lately. The transition from 3G to 4G meant a 10x increase in speed, but 5G will be at least 1,000 times faster than 4G. What does this mean to the PCB design community?
Check it all out this month in Design007 Magazine, now on the virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.
Share on:
Suggested Items
Würth Elektronik Now an Infineon ‘Preferred Partner’
03/13/2025 | Wurth Elektronik eiSosWürth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its collaboration with semiconductor manufacturers.
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
03/13/2025 | John Watson -- Column: Elementary, Mr. WatsonAt the 2020 Tokyo Summer Olympics, the U.S. men's 4x100-meter relay team had high hopes of winning a medal. The team comprised some of the fastest sprinters in the world, but something went wrong. In a relay, four runners must smoothly pass their baton to the next runner inside a zone on the track. If a runner drops the baton or it’s passed outside the zone, the team risks disqualification. The U.S. team’s pass between the second and third runner was messy, slowing them down. By the time the last runner received the baton, the team had lost too much time. They finished sixth in their heat and didn’t qualify for the final.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications
03/12/2025 | PRNewswireTexas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.
Speaking the Same Language as Your Fabricator
03/12/2025 | Andy Shaughnessy, Design007 MagazineWe do indeed have a failure to communicate; designers and fabricators often seem to be talking past each other, which can lead to jobs being put on hold. We asked Jen Kolar, VP of engineering for Monsoon Solutions, and columnist Kelly Dack to share their thoughts on ways that we can break down the communication barrier between design and fabrication. As they point out, a design kickoff checklist and a solid review process can be invaluable tools in a designer’s toolbox.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in