It’s Only Common Sense: Selling to Today's Generation of Buyers
Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
Ventec International Group Awarded IPC-4101/40 QPL Certification
May 22, 2018 | IPCEstimated reading time: 1 minute
IPC's Validation Services Program has awarded Ventec International Group, a global electronics materials manufacturing company headquartered in Suzhou, China, a second IPC-4101 Qualified Products Listing (QPL). Ventec successfully qualified their products, VT-90H and VT-901, to specification sheet 40 of IPC-4101E, Specification for Base Materials for Rigid and Multilayer Printed Boards.
Ventec, which manufactures and sells polyimide and high reliability epoxy laminates and prepregs, completed an intensive two-day audit where its manufacturing practices, test methods and conformance requirements of IPC-4101 were reviewed. Ventec met or exceeded the IPCs Validation Services QPL requirements for producing base materials used by printed circuit board manufacturers in the electronics industry. As a result, the company is successfully listed as an IPC-4101 trusted source capable of manufacturing in accordance with industry best practices to specification sheets 40 and 41. Ventec and other trusted sources of suppliers can be found on IPC's QML/QPL (Qualified Product Listing) database.
Mark Goodwin, COO USA & EMEA of Ventec International Group commented, "The IPC Qualified Product Listing (QPL) of our polyimide laminate and prepreg provides an independent endorsement of the quality of our production controls and materials for use in high reliability mil/aero applications. The IPC QPL is a trusted reference list for the entire electronics supply chain and we are delighted to be the first copper clad laminate manufacturer to have a polyimide material added to the validation services listing by meeting the requirements of both the rigorous facility audit and the qualification testing program at an independent test laboratory. We are fully committed to consistently meet and exceed the strict requirements of industry standards such as IPC-4101E."
IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies' products and identifies processes which conform to IPC standards. "Ventec has differentiated itself from the competition in the polyimide market by becoming part of IPC's global network of trusted industry sources," said Randy Cherry, IPC director of Validation Services. "We are pleased to recognize Ventec for becoming a trusted supplier conforming to IPC-4101E."
For more information about IPC's Validation Services QPL/QML Program, click here.
Share on:
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.