-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
ITEQ Ready for Autonomous and Electric Vehicles of the Future
May 23, 2018 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
During DesignCon 2018, I spoke with Tarun Amla, the executive vice president and CTO of ITEQ. We discussed ITEQ’s future plans, including the development of materials for cutting-edge technology needs, such as autonomous and electric vehicles, as well as 5G technology.
Andy Shaughnessy: How are you doing, Tarun? For anybody who's not familiar with ITEQ, why don't you give us a quick background?
Tarun Amla: Good to see you, Andy. ITEQ is headquartered in Taiwan. It started in 1997, so we just recently celebrated our 20th anniversary, and it's grown very rapidly. We are approximately 21 billion NT, which is about US$700 million in revenue. We have facilities in China—one in Wuxi, and another in Dongguan, and both are copper clad laminate manufacturing facilities. Additionally, we have a flexible copper clad laminate factory and an HDI factory in Guangdong, and then in the same area we have a mass lam facility. We are placed probably sixth globally in terms of revenue. It's been a story of great growth for us at ITEQ.
Shaughnessy: I understand you have some pretty interesting things you're working on for 2018.
Amla: Yes. What we're really excited about is that whatever's happening in the economy on a global scale—there's buoyancy out there. There's a lot of new technology coming to the fore. There's 5G deployment that's going to start somewhere around '19, '20, and there's autonomous driving, which is finding root; a lot of people are investing in it, and it creates demand for new materials that didn't exist before. Our roadmap is aligned to come up with new products which basically enable these technologies.
When the cloud revolution was happening, and people were installing these server farms, they needed lower-loss products, and that's what ITEQ had been focused on developing in the last few years. Now we've moved towards developing products that enable extremely high digital speeds up to 56 gigabits per second and beyond, 112 gigabits per second with the change in signaling and coding.
On our drawing board now are products that are going to enable autonomous driving, for radars going into the millimeter wave, products for 5G applications, products for cell phone applications, and for the EV revolution, because the electrical vehicles are taking over. A lot of governments have made commitments, like in China and Europe, and most of these cars will require a lot of fast charging stations, which, again, puts a huge demand on the material itself; these stations will be pushing electrical current at very high voltages through materials that must withstand these voltages without dielectric breakdown.
What is a problem for the industry is an opportunity for us, so we’re trying to create materials that can withstand these high stresses and enable the use of these technologies. We're very excited about this. The same thing is happening out there in the space industry, requiring materials which are lighter, faster, and more durable.
Shaughnessy: It seems like electric and autonomous vehicles would use more heavy copper.
Amla: Yes. There's going to be a heavy copper, but there are also technologies where people are learning to do more with less, so that's been the theme so far. When the high-speed digital revolution started, copper was supposed to be able to stand only five gigabits per second, and now we're approaching 112 Gbps. The same thing is happening here; where they needed six and 12 oz. copper, people have innovated and started using 3 oz. copper instead. That's happening.
To read this entire article, which appeared in the April 2018 issue of Design007 Magazine, click here.
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.