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Panasonic Develops Ultra-Low-Loss PCB Material for Packages and Modules
May 29, 2018 | Panasonic CorporationEstimated reading time: 1 minute
Panasonic Corporation has developed an ultra-low transmission loss circuit board material (Product No. Laminate R-G545L/R-G545E, Prepreg R-G540L/R-G540E) that is suitable for use in semiconductor packages and modules. The company will start mass-producing the material from June 2018. The newly developed material allows the stable operation of semiconductor devices that process enormous data at a high speed.
Due to the expansion of IoT (Internet of Things) network and the launch of the fifth-generation (5G) mobile communications system scheduled to be implemented in 2020. It is expected that the data communication will become further larger in volume and faster.
This circumstance has created a demand for circuit board materials used in semiconductor packages and modules that need to be adapted for high-speed/large-capacity data communication applications. From its original resin design technology, the company has developed the circuit board material with ultra-low transmission loss for semiconductor packages and modules. The material offers the lowest transmission loss among the other materials used in the industry.
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