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More Than Moore Devices: The Wind of Change
June 26, 2018 | Yole DéveloppementEstimated reading time: Less than a minute
Driven by the adoption of evermore electronic components in end products, the semiconductor industry is facing a new era in which device scaling and cost reduction will no longer continue on the path followed for the past few decades. Semiconductor companies are today looking for technology solutions to bridge the gap and improve cost/performance while at the same time adding more functionality through integration.
More-than-Moore devices (including MEMS & sensors, CMOS Image Sensors, power electronic, along with RF devices) represent this new functional diversification of technologies, combining performance, integration and cost not limited to CMOS scaling, and their importance will become more and more preponderant.
Between 2017 and 2023, the wafer demand for More than Moore devices is showing an impressive 10% growth (Wafer demand – 8-inch eq.). This increase is supported by the famous megatrends detailed in the new analysis, Wafer Starts for More Than Moore Applications, performed by Yole Développement (Yole). This analysis is relevant to the following markets: 5G with wireless infrastructure & mobile segments, mobile including additional functionalities, voice processing, smart automotive & electrification, AR/VR , and AI .
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