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Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
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Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
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If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
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Mentor PADS Webinar on July 12
June 29, 2018 | Mentor, a Siemens businessEstimated reading time: Less than a minute
Mentor, A Siemens Business, will be holding its monthly PADS Did You Know… Webinar Series on July 12, 2018 at 8:30 PST, 9:30 MST, 10:30 CST, 11:30 EST. The webinar series highlights topics that educate you on PADS and the challenges facing design engineers and how to best overcome them with our tools and add-ons.
This webinar focuses on how you can comfortably design your PCB and do thermal simulation at various phases of your design to produce a quality and highly reliably product design the first time.
The free-to-attend webinar delivered by Oasis Sales and Trilogic.
To register, click here.
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Sweeney Ng - CEE PCBSuggested Items
What Emerging Circularity Policies Mean for the Electronics Industry
11/20/2025 | I-Connect007 Editorial TeamAs Europe accelerates toward a circular economy, electronics manufacturers face a wave of new sustainability requirements that will redefine product design, materials management, and end-of-life strategies. During a Nov. 11 webinar co-hosted by the Global Electronics Association and the Anthesis Group, industry leaders outlined the regulatory landscape shaping the next decade, including the Eco-design for Sustainable Products Regulation (ESPR), the Right to Repair (R2R) Directive, and the Extended Producer Responsibility (EPR) regulatory framework.
TTCI Receives 2025 Global Technology Award for Redefining Design for Testability in High-Reliability Electronics
11/20/2025 | TTCIThe Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, has been awarded the 2025 Global Technology Award in the Test Services category for its groundbreaking work in Design for Testability (DFT).
Rubin’s Cableless Architecture and ASIC High-Layer HDI Designs Push PCBs to the Center of AI Compute Power
11/20/2025 | TrendForceTrendForce’s latest research points out that AI server design is undergoing a fundamental structural shift. From NVIDIA’s Rubin platform featuring a fully cableless architecture, to hyperscalers’ in-house ASIC servers adopting ultra-high-layer HDI designs, PCBs are no longer merely passive circuit carriers—they are becoming a core enabler of compute performance.
Accelerating the Global Commercialization of AR Waveguide Technology with AAC Technologies
11/19/2025 | Globe NewswireAAC Technologies Pte. Ltd., a world-leading smart device solution provider and a company incorporated in Singapore and a fully-owned subsidiary of AAC Technologies Holdings Inc., whose shares are listed and traded on the Hong Kong Stock Exchange, has signed a definitive agreement to acquire the shares and other equity securities in Dispelix Oy, a technology leader in diffractive waveguide displays for augmented reality (AR).
Flexible Circuit Technologies Welcomes Senior Applications Engineer Zack Schaner
11/18/2025 | Flexible Circuit TechnologiesFlexible Circuit Technologies a Minnesota-based flexible circuit and advanced electronics contract manufacturer, welcomes Zack Schaner as Senior Applications Engineer.