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Dave Bergman on IPC and CFX
July 3, 2018 | Barry Matties, I-Connect007Estimated reading time: 8 minutes
Bergman: From the standpoint of IPC in Europe, when we started discussing all the activities IPC has going on in Nuremberg, we were a bit surprised ourselves. It is important to recognize the cooperation between IPC and Mesago, the organizers of the SMT Hybrid Show. We decided to piggyback on one of our professional development events. We held an automotive electronics reliability conference with 50 to 60 people at a nearby hotel and Mesago helped us with marketing the conference. Mesago was also a great help with IPC CFX showcase marketing. Further, we held six or seven committee meetings working on different IPC standards that are the European-led. All of this was going on while we had a stand at the show and a hand soldering competition. We have nine IPC staff members at the show, certainly the most active IPC event in Europe. It is great to see a positive response to IPC programs here.
Matties: That's great. It's like when I'm in China. I hear about a lot of growing IPC successes there and it sounds like things are also going really well here.
Bergman: It's cooking.
Matties: Congratulations, and we'll talk to you soon.
Bergman: Good talking to you, Barry.
Page 2 of 2Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
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10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
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