Connect the Dots: Proactive Controlled Impedance
Beyond Design: Radiation and Interference Coupling
Elementary, Mr. Watson: Design Data Packages—Circle of Concern or Circle of Influence?
Benefits of Low-Temp Soldering: I-007eBook Now Available
July 31, 2018 | I-Connect007Estimated reading time: 1 minute
Tired of solder joint failures? Get your head off the pillow! Learn about opportunities and solutions provided by low-temperature soldering in I-Connect007’s newest micro eBook: The Printed Circuit Assembler’s Guide to… Low-Temperature Soldering.
The Printed Circuit Assembler’s Guide to… is an ongoing book series specifically dedicated to educating PCB assemblers and serves as a go-to resource for essential assembly topics.
Written by Morgana Ribas and other expert authors from Alpha Assembly Solutions, this book provides an introduction to the evolution of modern low-temperature soldering, illustrates the importance of chemistry when developing low-temperature solders, and discusses advanced and emerging applications where lower melting point alloys can provide unique assembly solutions.
“Due to the recent burgeoning in the use of low-temperature solders within the electronics assembly industry, much has been written about bismuth- and tin-based solders and solder pastes. This book does a good job of distilling out the chaff and focusing on the most relevant, valuable information available,” says Raiyo Aspandiar, senior engineer at Intel Corporation.
Readers will learn the benefits low-temperature alloys have to offer, such as reducing costs, creating more reliable solder joints, and overcoming design limitations with traditional alloys.
Download your free copy today! You can also view other titles in our full library.
We hope you enjoy The Printed Circuit Assembler’s Guide to… Low-Temperature Soldering.
For more information, contact:
Barb Hockaday
I-007eBooks
+1-916-365-1727 (GMT-8)
Share on:
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.