Dan’s Biz Bookshelf: ‘Born to Create’
It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Marcy's Musings: Engineering Economics
Ventec International Group Appoints Jason Chung as CEO
July 31, 2018 | Ventec International GroupEstimated reading time: 1 minute
Ventec International Group Co., Ltd. announced that its Board of Directors has elected Jason Chung as group CEO with immediate effect. Chung succeeds Tony Lau who continues in his role as chairman of board of directors.
For the time being, Chung will also continue to lead the group's Asia operations as COO for the region, alongside Mark Goodwin who is COO for Europe and the Americas.
As one of the founding members of Ventec, Chung has played an integral role in driving the company's growth, global success and recent transformation from a privately-owned company to a publicly-listed global organization.
"Jason is an accomplished executive with a deep understanding of our business, vision, operations and the strategies we are implementing worldwide," said Tony Lau, chairman of the board of directors. "Ventec is amid a transformative phase of its impressive history, having been successfully listed and trading on the Emerging Stock Market of the Taipei Stock Exchange since 16 January 2018 and currently completing the process for a TPEx Mainboard listing for early 2019. We are confident that under Jason's leadership, Ventec is well-positioned to realize the benefits of this transformation and to build on the company's strengths, driving long-term growth and increasing shareholder value."
"I am honored to be appointed chief executive officer of Ventec," said Chung. "As one of Ventec's original founders, I have a unique connection to the company and it is a great privilege to lead an incredible and talented global team as, together, we strive to evolve and scale to even greater heights in 2018 and beyond."
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
Visit I-007eBooks to download your copies of Ventec International micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
Share on:
Suggested Items
Fresh PCB Concepts: PCB Design Essentials for Electric Vehicle Charging
11/27/2024 | Team NCAB -- Column: Fresh PCB ConceptsElectric vehicles (EVs), powered by electricity rather than fossil fuels, are transforming transportation and reducing environmental impacts. But what good is an EV if it can't be easily charged? In this month's column, Ramon Roche dives into the role of printed circuit boards (PCBs) in electric vehicle charging (EVC)—and the design considerations.
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.