-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2019
August 6, 2018 | IPCEstimated reading time: 1 minute
IPC — Association Connecting Electronics Industries invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, January 30, 2019, and will be displayed throughout the event, offering additional visibility.
Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes and equipment and test, especially:
- 3D Printing in Electronics Manufacturing
- Automation in Electronics Manufacturing
- Adhesives
- Advanced Technology
- Area Array/Flip Chip/0201 Metric
- Assembly and Rework Processes
- BGA/CSP Packaging
- Black Pad and Other Board Related Defect Issues
- BTC/QFN/LGA/MLF Components
- Business & Supply Chain Issues
- Cleaning
- Conformal Coatings
- Corrosion
- Counterfeit Electronics
- Design
- Electromigration
- Electronics Manufacturing Services
- Embedded Passive & Active Devices
- Environmental Compliance
- Graphene in Electronics Manufacturing
- Lean Six Sigma
- LED Manufacturing
- ilure Analysis
- Flexible Circuitry
- HDI Technologies
- Head-on-Pillow
- Board and Component Warpage
- High Speed, High Frequency & Signal Integrity
- Industry 4.0
- Lead-Free Fabrication, Assembly & Reliability
- Miniaturization
- Nanotechnology
- Optoelectronics
- Packaging & Components
- PCB Fabrication
- PCB and Component Storage & Handling Performance
- Quality & Reliability
- Photovoltaics
- PoP (Package-on-Package)
- Printed Electronics
- Reshoring
- RFID Circuitry
- Robotics
- Soldering
- Surface Finishes
- Test, Inspection & AOI
- Tin Whiskers
- 2.5-D/3-D Component Packaging
- Underfills
- Via Plugging & Other Protection
- Wearables
An abstract of up to 300 words summarizing technical and previously unpublished work covering case histories, research and discoveries should be submitted by Friday, September 21, 2018, click here.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4,300 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China. For more information, click here.
Suggested Items
Delta SEA Partner Event 2025 Unites Regional Partners to Embrace a “Future Ready” Vision
07/03/2025 | Delta ElectronicsDelta Electronics (Thailand) Public Company Limited, successfully hosted its Delta SEA Partner Event 2025: Future Ready at Delta Chungli Plant 5, Taiwan on June 10 – 11 , 2025.
Murray Percival Company Welcomes CeTaQ to Its Line Card, Optimizing SMT Processes for PCB Manufacturers
07/03/2025 | Murray Percival CompanyThe Murray Percival Company, a trusted supplier to the Midwest's electronics industry, is pleased to announce that it has added CeTaQ to its line card, a global expert in Surface Mount Technology (SMT) measurement systems.
RBB’s Jeff Schartiger Appointed to SMTA Ohio Board as Technical Advisor
07/03/2025 | RBBRBB, a trusted leader in electronics manufacturing since 1973, is proud to announce that Jeff Schartiger, Operations Manager at RBB, has been appointed to the SMTA Ohio Chapter Board as a Technical Advisor.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
Eiyu Electronics Launches Pre-Assembled Module Product Line to Simplify Sourcing for Embedded Projects
07/02/2025 | BUSINESS WIREEiyu Electronics Co., Ltd., a Hong Kong-based electronic component trading company, today announced the official launch of its pre-assembled module product line, designed to help engineers and procurement teams save time when sourcing complex modular components.