Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
The Shaughnessy Report: Breaking Down the Language Barrier
Connect the Dots: Designing for Reality—Routing, Final Fab, and QC
IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2019
August 6, 2018 | IPCEstimated reading time: 1 minute
IPC — Association Connecting Electronics Industries invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, January 30, 2019, and will be displayed throughout the event, offering additional visibility.
Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes and equipment and test, especially:
- 3D Printing in Electronics Manufacturing
- Automation in Electronics Manufacturing
- Adhesives
- Advanced Technology
- Area Array/Flip Chip/0201 Metric
- Assembly and Rework Processes
- BGA/CSP Packaging
- Black Pad and Other Board Related Defect Issues
- BTC/QFN/LGA/MLF Components
- Business & Supply Chain Issues
- Cleaning
- Conformal Coatings
- Corrosion
- Counterfeit Electronics
- Design
- Electromigration
- Electronics Manufacturing Services
- Embedded Passive & Active Devices
- Environmental Compliance
- Graphene in Electronics Manufacturing
- Lean Six Sigma
- LED Manufacturing
- ilure Analysis
- Flexible Circuitry
- HDI Technologies
- Head-on-Pillow
- Board and Component Warpage
- High Speed, High Frequency & Signal Integrity
- Industry 4.0
- Lead-Free Fabrication, Assembly & Reliability
- Miniaturization
- Nanotechnology
- Optoelectronics
- Packaging & Components
- PCB Fabrication
- PCB and Component Storage & Handling Performance
- Quality & Reliability
- Photovoltaics
- PoP (Package-on-Package)
- Printed Electronics
- Reshoring
- RFID Circuitry
- Robotics
- Soldering
- Surface Finishes
- Test, Inspection & AOI
- Tin Whiskers
- 2.5-D/3-D Component Packaging
- Underfills
- Via Plugging & Other Protection
- Wearables
An abstract of up to 300 words summarizing technical and previously unpublished work covering case histories, research and discoveries should be submitted by Friday, September 21, 2018, click here.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4,300 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China. For more information, click here.
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