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In the process, because of poor conduction caused by residual glue and poor plating after laser drilling, it is more likely to be completely OPEN after high-temperature welding at the client end, as shown in Figure 10.
Figure 10: Blind buried hole defect.
The coil plate must test the etch fluctuation of the coil and detect the short circuit problem in the coil, as shown in Figure 11.
Figure 11: Circuit defect.
The above problems can be tested by the following methods:
This test method and software have obtained the National Computer Software Copyright Registration Certificate. The certificate number is No. 0926001.
Test Basis
The resistance value of each line on the board is automatically learned by the machine. The standard resistance of each circuit of this batch of boards is calculated by the software of “Board Test Analysis System Software.” The unique convergence of the discriminatory principle, you can get rid of all abnormal data in the study, the volatility can help engineers quickly understand the batch status. And according to the learning resistance fluctuations, accurate error setting values are given.
Figure 12: Board test analysis software.
In Conclusion
With the four-wire and four-terminal flying probe test method, voids in the holes formed in the PCB due to process differences, thin copper, and poor conduction due to residual adhesive after laser drilling of the HDI board can be detected, and the circuit board guide can be solved. With the development of multilayer, high-density PCB layout, four-wire four-terminal flying probe testing will play an increasingly important role.
Jin Erbing is customer service director at Joint Stars Technology Co. LTD.
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