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Zuken USA Issues Call for Papers for Zuken Innovation World 2019
August 16, 2018 | ZukenEstimated reading time: 1 minute
Zuken USA is now accepting abstracts for Zuken Innovation World (ZIW) 2019, to be held on April 15-17 in Hilton Head, South Carolina. The event includes a two-day technical conference and one-day exhibition to be held at the Hilton Head Marriott Resort & Spa.
Abstracts are now being accepted for 45-minute educational presentations. The technical program consists of four tracks focused on the following areas:
- Board design, including SI/PI/EMC, ECAD/MCAD co-design and IC packaging
- Electrical design including wire harness, panel and fluid design
- Design data and library management, including supply chain and PLM integration
- Innovative technologies and design methodologies, including Model Based Systems Engineering (MBSE)
Suggested presentation topics include design disciplines such as PCB, IC packaging, wire harness, control panel and design data management. Industry trends, process innovation and new design methodologies are also topics of interest. Presentations must be noncommercial in nature and should focus on technology, techniques or methodology. Case studies, how-to information and usage tips are favored and individual or team presentations are welcome.
Abstracts of 300 words, along with speaker biographies, should be submitted to Zuken by November 2, 2018. For additional details and deadline information, visit the ZIW Speakers’ Corner.
Education and Innovation
ZIW annually offers more than 40 technical sessions, including Zuken University classes showcasing how-to and best practices for the current and upcoming product releases. Zuken’s Expert Bar provides one-on-one access to Zuken’s technical team, while the Technology Showcase puts our partners’ innovative solutions front and center in a relaxed, interactive environment that encourages networking.
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Sweeney Ng - CEE PCBSuggested Items
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Staying on Top of Signal Integrity Challenges
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American Standard Circuits to Exhibit and Host Lunch & Learn at PCB West 2025
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ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
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