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Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Zuken USA Issues Call for Papers for Zuken Innovation World 2019
August 16, 2018 | ZukenEstimated reading time: 1 minute
Zuken USA is now accepting abstracts for Zuken Innovation World (ZIW) 2019, to be held on April 15-17 in Hilton Head, South Carolina. The event includes a two-day technical conference and one-day exhibition to be held at the Hilton Head Marriott Resort & Spa.
Abstracts are now being accepted for 45-minute educational presentations. The technical program consists of four tracks focused on the following areas:
- Board design, including SI/PI/EMC, ECAD/MCAD co-design and IC packaging
- Electrical design including wire harness, panel and fluid design
- Design data and library management, including supply chain and PLM integration
- Innovative technologies and design methodologies, including Model Based Systems Engineering (MBSE)
Suggested presentation topics include design disciplines such as PCB, IC packaging, wire harness, control panel and design data management. Industry trends, process innovation and new design methodologies are also topics of interest. Presentations must be noncommercial in nature and should focus on technology, techniques or methodology. Case studies, how-to information and usage tips are favored and individual or team presentations are welcome.
Abstracts of 300 words, along with speaker biographies, should be submitted to Zuken by November 2, 2018. For additional details and deadline information, visit the ZIW Speakers’ Corner.
Education and Innovation
ZIW annually offers more than 40 technical sessions, including Zuken University classes showcasing how-to and best practices for the current and upcoming product releases. Zuken’s Expert Bar provides one-on-one access to Zuken’s technical team, while the Technology Showcase puts our partners’ innovative solutions front and center in a relaxed, interactive environment that encourages networking.
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Siemens Expands OSAT Alliance Membership to Build Domestic Semiconductor Supply Chains
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Standards: The Roadmap for Your Ideal Data Package
05/29/2025 | Andy Shaughnessy, Design007 MagazineIn this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.
High-frequency EMC Noise in DC Circuits
05/29/2025 | Karen Burnham, EMC UnitedEMC isn’t black magic, but it’s easy to understand why it seems that way. When looking at a schematic like that in Figure 1, it looks like you’re only dealing with DC signals all across the board. There’s a 28 VDC input that goes through an EMI filter, then gets converted to 12 VDC power. Except in extremely rare circumstances involving equipment sensitive to magnetostatic fields, DC electricity will never be part of an EMC problem.