-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC and SMTA to Present High-Reliability Cleaning and Conformal Coating Conference
August 27, 2018 | IPCEstimated reading time: 1 minute
IPC – Association Connecting Electronics Industries in partnership with Surface Mount Technology Association (SMTA) will host the High-Reliability Cleaning and Conformal Coating Conference, November 13–15, at the Chicago Marriott in Schaumburg, Illinois. The 2018 conference will focus on electronics assembly and the influence of cleanliness and coating on producing reliable hardware.
Prior to the technical conference, a full-day of classroom tutorials will be held on November 13 and will introduce attendees to basic/intermediate-level instruction. In the morning, Doug Pauls, Rockwell Collins, will present “IPC-J-STD-001G Am1-Cleaniness Requirements.” In the afternoon session, instructor Jason Keeping, Celestica, will present “Conformal Coating Best Practices.”
The technical conference begins on November 14 with opening remarks from Program Chair Dr. Mike Bixenman, KYZEN Corporation. Conference sessions on day one include: cleanliness considerations for building reliable hardware, jet printing cleaning challenges, adapting coating applications for high density electronics and improving reliability of circuit assemblies in harsh environments.
Conference sessions on day two will cover ultra-thin conformal coatings advancements, cleaning/coating test methods and process considerations links between design manufacturing, methods for conformal coating masking and engineering performance, compatibility and environmental conformance of cleaning agents.
“Today, how to address the issue of ‘how clean is clean’ is quite a challenge, as conductors and circuit traces have become increasingly narrower. What is acceptably clean for one industry segment may be unacceptable in others” said conference program chairman Dr. Mike Bixenman, CTO and founder of KYZEN Corporation. “This comprehensive event includes technical sessions, tutorials, tabletop exhibits and networking activities. It will cover technological developments in all areas of cleaning and coating with an emphasis on real-world problems and solutions.”
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4,400 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
For complete event agenda and registration information, click here.
Suggested Items
Wolfspeed Stock Soars After Filing for Chapter 11 Bankruptcy
07/01/2025 | I-Connect007 Editorial TeamOn July 1, Wolfspeed shares doubled following the company’s announcement on June 30 that it had filed for Chapter 11 bankruptcy protection.
Zollner Completes Full Acquisition of Bluechips Microhouse
07/01/2025 | Zollner Elektronik AGZollner Elektronik AG has successfully finalized its com- plete takeover of Bluechips Microhouse Co., Ltd., in Thailand. In the future the company will operate as part of the Zollner Group of companies under the leadership of Thomas Kiefl – strategically networked, technologically focused and internationally oriented.
Inission Acquires the Lithuanian Company Selteka
07/01/2025 | InissionInission AB has signed an agreement to acquire 100% of UAB Selteka. Selteka is a well-respected EMS (electronics manufacturing services) company with operations located in Kaunas, Lithuania.
RTX, Shield AI Partner to Develop New Defense Capabilities
07/01/2025 | RTXRTX and Shield AI announced a new partnership to integrate Shield AI capabilities into select RTX defense products, like loitering munitions and sensors. This collaboration will deliver enhanced, autonomous capabilities to US and allied defense forces.
Lockheed Martin Completes Acquisition of Amentum’s Rapid Solutions Portfolio
07/01/2025 | Lockheed MartinLockheed Martin has closed its acquisition of the Rapid Solutions business of Amentum, an engineering and technology solutions company.