Connect the Dots: How to Avoid Five Common Causes of Board Failure
Fresh PCB Concepts: Designing for Success at the Rigid-flex Transition Area 
Elementary Mr. Watson: Routing Hunger Games—May the Traces Be Ever in Your Favor
Pulsonix Version 10.0 Features 3D PCB Design
August 30, 2018 | PulsonixEstimated reading time: 2 minutes
WestDev Ltd. launches the next level of progression in its Pulsonix product with the release of version 10.0.
The latest release of Pulsonix expands its product portfolio with intelligent interactive editing within the 3D design environment. By enabling the co-design of the PCB within the 2D PCB and 3D environments, Pulsonix shortens the time to market with a more productive workflow and reduces costly errors.
The new interactive 3D design environment is complimented by new interactive functionality enabling dynamic Copper Pouring and shape healing. Automatic Pad Style Naming has also been introduced to ensure maximum efficiency for the user.
Interactive PCB and 3D Design Environment
Version 10 allows Mechanical enclosures to be integrated into the native Pulsonix 3D environment for modelling and critical clash detection. This tight integration alerts the engineer where items violate the rules defined. Once alerted, the offending item can then be moved directly from within the 3D Editor in Pulsonix and all changes automatically updated in the PCB design.
With both the detection of physical collisions between enclosures and components, and the subsequent resolution to a legal state, Pulsonix allows engineers to design more intelligently and efficiently, without needing to continually request updates on component positions from their mechanical CAD colleagues, thus saving valuable design time.
In today’s world of multi-disciplined facets and engineering demands, the new Pulsonix clash detection functionality significantly closes the gap between the electronics and the mechanical design environments.
New 3D Functionality Summary:
- Import Mechanical enclosures into the Pulsonix 3D environment
- Move components and enclosures in 3D Design
- Adhere to design rules for movement and placement of components
- Clash detection and resolution between Components and Enclosures
Dynamic Copper Pour
In addition to the 3D functionality, Pulsonix 10.0 also introduces the ability to dynamically repour copper areas during editing. This saves critical design time without the need to manually repour copper areas; instead, routing a track through the copper shape or moving a design item, such as a component or via, will automatically ‘heal’ the copper, all performed dynamically whilst obeying the design rules. With new zonal shape algorithms used in Pulsonix 10.0, only ‘damaged’ areas of copper are repaired making the healing much faster on large designs or designs with many complex poured areas.
Automatic Pad Naming Conventions
Style Naming Rules enable users in Pulsonix 10.0 to automatically comply to their company standards or with industry standard rules such as the IPC standard. A naming standard can be defined within a Technology file, this is then adhered to whenever a new style is created by the user. Although Style Naming rules can be applied to any item style, it is particularly useful for Pad Styles where the name requires a standard naming style applied to it, as would be the case for the IPC standard.
About Pulsonix Overview
Introduced in 2001, Pulsonix EDA software has made its mark to set the standard for high-performance Schematic design capture, Simulation, PCB layout and autorouting. Developed by a dedicated in-house team, each release demonstrates how the fast-growing Pulsonix product is introducing key features to win new business and offer users flexible and highly compatible software that meets the demands of PCB design today.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.
How Good Design Enables Sustainable PCBs
08/21/2025 | Gerry Partida, Summit InterconnectSustainability has become a key focus for PCB companies seeking to reduce waste, conserve energy, and optimize resources. While many discussions on sustainability center around materials or energy-efficient processes, PCB design is an often overlooked factor that lies at the heart of manufacturing. Good design practices, especially those based on established IPC standards, play a central role in enabling sustainable PCB production. By ensuring designs are manufacturable and reliable, engineers can significantly reduce the environmental impact of their products.
50% Copper Tariffs, 100% Chip Uncertainty, and a Truce
08/19/2025 | Andy Shaughnessy, I-Connect007If you’re like me, tariffs were not on your radar screen until a few months ago, but now political rhetoric has turned to presidential action. Tariffs are front-page news with major developments coming directly from the Oval Office. These are not typical times. President Donald Trump campaigned on tariff reform, and he’s now busy revamping America’s tariff policy.
Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
08/14/2025 | Markus Voeltz -- Column: Global PCB ConnectionsDesigners don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.