-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Cadence DesignTrue DFM Ecosystem Connects Manufacturers with Customers
September 4, 2018 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes
Cadence Design Systems, Inc. has launched a broad ecosystem with nine initial printed circuit board (PCB) manufacturing partners to enable customers to easily get the partners’ technology files they need to ensure PCB design manufacturability early in the design process. This reduces rework, shortens design cycles, and accelerates new product introduction. Customers have received savings from half to two-thirds fewer technical queries (TQs) from manufacturers when they’ve used the Cadence DesignTrue DFM (design for manufacturability) technology due to using tailor-made spacing, annular ring, copper features and mask rules to assure they are designing the board correctly the first time.
Cadence DesignTrue DFM functionality flags manufacturing rule violations in real time during the PCB layout process with both the Allegro and OrCAD design tools. All other PCB design tools demand designers wait until the design is complete to do DFM signoff on manufacturing outputs, which often requires significant rework and schedule delays.
Nine PCB manufacturers have already become Cadence DesignTrue partners, allowing them to distribute their manufacturing rules to Cadence customers. These include Bay Area Circuits, CircuitHub, Mass Design, Multek, OSH Park, Rocket EMS, Sierra Circuits, Tempo Automation and Würth Elektronik.
“Our goal is to improve PCB designer productivity, and this large ecosystem and new web portals allow our customers to significantly shorten their design cycles with the industry’s first real-time in-design DFM checking,” said Steve Durrill, senior product engineering group director at Cadence. “Instead of manually adding the rules to their PCB design environment, now they can quickly download the appropriate file and update as required.”
By creating new web portals, Cadence is ensuring that customers can access the latest DFM rules from the PCB manufacturers at the start of their design process. Customers can view participating manufacturers and request DesignTrue DFM technology files directly, eliminating the lengthy and error-prone manual entry of hundreds of rules. DFM rules are checked in real time as part of the PCB layout process, reducing the amount of DFM errors found in the manufacturing output. These checks prevent crucial manufacturing errors and limit iterations required to fix such errors. Partners can use the vendor portal to easily distribute rules that match their post-process DFM checks. Cadence users can take advantage of the customer portal to request and receive the rules they need from the manufacturers.
“The Cadence DesignTrue DFM partner program allows us to easily share our PCB manufacturing rules to Cadence customers,” said Dana Korf, senior director Central Manufacturing Engineering and NPI, Multek. “This ensures our customers are designing to our most up-to-date manufacturing constraints, greatly reducing the number of iterations to address DFM errors that we normally see in the PCB signoff process. This will help our customers get their designs done faster, accelerating new product introduction.”
About Cadence
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more here.
Suggested Items
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.
SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition
12/16/2024 | SCHMID GroupThe SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.
OKI Develops PCB Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer Space
12/12/2024 | BUSINESS WIREThe OKI Group printed circuit board (PCB) business company OKI Circuit Technology has successfully developed multilayer PCB technology with stepped copper coin insertion to achieve 55 times better heat dissipation compared to conventional PCB. The stepped copper coin is offered in two types, circular and rectangular, to suit the shape of the electronic component mounted on the PCB. OTC is working to develop mass-production technologies with the aim of introducing PCBs incorporating this new technology into markets for compact devices or devices used in outer space or other environments where air cooling technology cannot be used.
Fresh PCB Concepts: PCB Plating Process Overview
12/12/2024 | Team NCAB -- Column: Fresh PCB ConceptsIn this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as mechanical properties or size limitations of the alternatives, PCBs will remain the standard low-cost interconnection technology. Rapidly increasing performance and functionality requirements of wireless and high-speed devices have challenged the development and implementation of new manufacturing solutions.