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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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MacDermid Enthone Advanced Electronics Solutions to Present at the 2018 IMAPS International Conference
September 18, 2018 | MacDermid Enthone Electronics SolutionsEstimated reading time: 1 minute
MacDermid Enthone Electronics Solutions (MEES), a MacDermid Performance Solutions business, will present at the 51st International Symposium on Microelectronics - IMAPS 2018. The conference will be held October 8-11, at the Pasadena Convention Center, Pasadena, California, USA.
Eric Gongora, general manager Americas and Europe and strategic marketing director of Wafer Level Packaging, MacDermid Enthone Advanced Electronics Solutions (AES), will address the continuous challenges faced in developing advanced packaging electroplating chemistries required to meet the performance, operational efficiency and time to market demands driven by the need for higher level of integration and heterogeneous solutions. Eric will present his paper; “Customization of Chemistry Continues“, on Wednesday, October 10 Session 118 at 11:00am. Eric will also serve as Session Chair for the Wafer-level Fan Out segment of the conference.
AES, a segment within the MEES business, is a global leader in high performance semiconductor chemistries and assembly materials. AES engages directly with OEMs, IDMs, wafer foundries, OSATs and tool suppliers to collaboratively develop solutions that meet the fast paced semiconductor market demands.
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there.
For more information, click here.
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Simon Khesin - Schmoll MaschinenSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/15/2026 | Nolan Johnson, I-Connect007When you work in the news business, even in trade media, you can never really get that far away from it. We never want to miss something important. Chances are, even the books we take on our “vacations” end up having to do with the business. For example, my colleague Michelle Te recommended “Creativity, Inc., by Ed Catmull, a business skills study wrapped up in stories about Pixar, which I brought with me on a trip through the stunning U.S. Mountain West. Now, I’m back, and here are my recommendations for the week.
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05/15/2026 | IncapIncap India has completed the installation of a new flying probe test system and a full SMT (Surface-Mount Technology) line upgrade at its Tumkur factory.
Interlink Electronics Reports Q1 2026 Results
05/15/2026 | Globe NewswireRevenue for the first quarter of 2026 increased 15% to $3.07 million, compared to $2.66 million in the first quarter of 2025. The increase was driven by higher shipments of the Company’s force-sensing and printed electronics products, partially offset by lower sales of its gas‑sensor products.
New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability
05/14/2026 | I-Connect007I-Connect007 proudly announces the recent release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new volume offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.
Nortech Systems Reports Q1 Results
05/14/2026 | Globe NewswireNortech Systems Incorporated, a leading provider of engineering and manufacturing solutions for complex electromedical and electromechanical products serving the medical imaging, medical device, industrial, and aerospace & defense markets, reported financial results for the first quarter ended March 31, 2026.