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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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iNEMI Webinar: Creep Corrosion Testing
September 20, 2018 | iNEMIEstimated reading time: 1 minute
The iNEMI Qualification Test Development for Creep Corrosion project team has developed an innovative flowers-of-sulfur (FoS) corrosion test that is inexpensive, easy to maintain and can be used to determine whether printed circuit board assemblies are likely to develop creep corrosion.
Creep corrosion is the corrosion of metallization and the migration of that corrosion across printed circuit board (PCB) surfaces. Problems arise when the corrosion migrates to such an extent that it bridges features on PCBs, causing electrical short circuits. The elimination of lead in electronics and the expansion of markets in regions such as Asia, where environments are often humid and/or have high levels of sulfur-bearing pollution, has brought corrosion-related failures to the forefront in recent years.
The test has been very successful in accurately reproducing creep corrosion on PCBs and has the potential to be used as a general-purpose corrosion chamber for material and technology development to mitigate corrosion failures.
For more information, click here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Incap India Invests in Testing and SMT Upgrades to Scale Production
05/15/2026 | IncapIncap India has completed the installation of a new flying probe test system and a full SMT (Surface-Mount Technology) line upgrade at its Tumkur factory.
BAE Systems Provides Advanced Aircraft Readiness with New Link 16 Test Capability for F-16
05/14/2026 | BAE SystemsBAE Systems has completed the successful development and integration of an upgraded Link 16 test capability for Multifunctional Information Distribution System Joint Tactical Radio System (MIDS JTRS) terminals on U.S. Air Force F-16 aircraft.
Separating Fact from Fear on the FCC ‘China Lab Ban’
05/14/2026 | Jan Pedersen, NCAB GroupRecent news headlines have suggested that the U.S. Federal Communications Commission (FCC) has “banned all testing laboratories in China and Hong Kong.” Understandably, this has created concerns around PCB testing, material approvals, UL listings, and the continued use of established test laboratories in Asia. The good news is that for most PCB, PCB material, and PCBA testing, nothing has changed. Let’s separate fact from fear.
yieldWerx, WATS Partner to Bridge PCB Test with Chip-Level Manufacturing Data
05/11/2026 | PRNewswireBoard-level and semiconductor test data are often analyzed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional test, with upstream wafer, sort, and final test data remains difficult, particularly in photonics, advanced packaging, and high-density integration environments.
SPEA Expands Global Footprint with New Hub in Santa Clara, Silicon Valley
05/08/2026 | SPEASPEA has officially landed in the heart of Silicon Valley, with the grand opening of its newest facility in Santa Clara, California.