-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Tarja Rapala-Virtanen Named as EIPC's New Technical Director
September 25, 2018 | EIPCEstimated reading time: 1 minute
The board of directors of the European Institute for the PCB Community (EIPC) are delighted to announce that they have appointed Tarja Rapala-Virtanen as their new technical director.
It is doubtful that anyone in the PCB industry will not have heard of Tarja, but just in case here is a little bit about her. Tarja Rapala-Virtanen studied in Åbo Akademi, Turku, Finland and finished with a M.Sc degree in chemical engineering. She has over 25 years’ experience in managing complex electronics projects in multicultural environments. She is multi-talented technology professional having comprehensive experience and know-how in all key PCB processes and technologies. She has been leading global engineering and R&D functions both in Finland and China, and her ability to build multidisciplinary teams to deliver advanced interconnection solutions has enabled her to be involved in the management and coordination of international collaboration projects in FIN, EU, US and China. The strong technology competence combined with her commercial know-how has been a good asset in road mapping, new process & product development, customer support and technical sales.
She has published several technical articles and conference papers in international conferences organized by IPC, EIPC, IMAPS, IEEE around the world, and has given lessons in PCB technology in Finnish technical Universities as invited guest.
At the Electronic Circuit World Convention 8 (ECWC8) in Tokyo in 1999 and at the ECWC9 in Cologne in 2002, she received the “Best Paper Award” for outstanding work and communication about advanced technology development in future PCB technology. In 2006 she received the coveted outstanding paper award from Emerald LiteratiNetwork
Tarja is the perfect successor to Michael Weinhold who served the Institute for so many years, and EIPC is very proud and happy that she has agreed to join us.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Celestica Provides Update on New Operations in Fort Worth, Texas
05/15/2026 | CelesticaCelestica Inc. a global leader in data center infrastructure and advanced technology solutions, provided an update on its plans to establish operations in AllianceTexas in Fort Worth, Texas.
Interlink Electronics Reports Q1 2026 Results
05/15/2026 | Globe NewswireRevenue for the first quarter of 2026 increased 15% to $3.07 million, compared to $2.66 million in the first quarter of 2025. The increase was driven by higher shipments of the Company’s force-sensing and printed electronics products, partially offset by lower sales of its gas‑sensor products.
SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.
What Heterogeneous Integration Means for EMS Providers
05/14/2026 | Nolan Johnson, I-Connect007Dr. Ravi Mahajan, an Intel Fellow and Director of Intel’s Technology and Pathfinding group, delivered a keynote at the APEX EXPO 2026 technical conference on using heterogeneous integration (HI) as a strategy and on how advanced packaging technology serves as the technical apex for implementing that strategy. Mahajan’s previous papers and industry presentations on such topics as interconnect density, signal integrity, power delivery, thermal path, and assembly yield as system-level constraints confirm him as an expert on package optimization.
Zhen Ding Reports Record 1Q26 Revenue; Up 1.6% YoY
05/14/2026 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, announced its consolidated financial results for the first quarter of 2026. First quarter revenue reached NT$40,728 million, up 1.6% YoY and setting a record high for the same period. Net income was NT$2,047 million, and net income attributable to the parent company was NT$1,426 million, with EPS of NT$1.33.