-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Xcerra’s Flagship Test Platform Brings Flexibility and Scalability to Display Driver Test
September 28, 2018 | Xcerra Corp.Estimated reading time: 2 minutes

Xcerra’s highly flexible Diamondx test platform can scale up to over 5000 display driver digitizers, supporting aggressive multi-site production strategies. With a wide range of general purpose and specialized instruments, the Diamondx platform meets the current and future test requirements of display driver devices, as well as the complete spectrum of multimedia ICs.
Touch and display driver integration (TDDI) IC shipments continue to ramp, and are expected to hit the 500 million mark in 2018 (Digitimes, March 28, 2018: https://www.digitimes.com/news/a20180328PD214.html?mod=3&q=TDDI+500&chid=9 ). Driven by bezel-less display technology popular in the latest high-end smartphone designs, TDDI chips are seeing mainstream adoption after an extended incubation period. TDDI chips offer clear benefits, such as lower cost, a thinner panel assembly, and better performance, over their discrete competitors. TDDI chips present significant challenges, however, for established display driver ATE solutions.
With the addition of the PD2x instrument, a specialized instrument designed to test leading edge display driver IC’s, the Diamondx can help realize the full potential of TDDI. With a scalable universal slot architecture, Diamondx can scale up to over 5000 display driver digitizers, supporting aggressive multi-site production strategies. Furthermore, with the introduction of the HSI1x 12.8Gbps SerDes test instrument, the Diamondx has channel count and performance headroom to meet the future needs of the display driver digital interfaces.
Christopher Lemoine, Product Marketing Director, highlights: “Traditional display driver ATE systems are specialized systems designed to test the driver row/column drivers, power management, logic and memory functions found in display driver IC’s. Adding touch controllers to these chips exposes gaps in the capabilities of existing display driver ATE, and the limited scalability of these solutions inhibits the cost benefits of TDDI. With a wide range of general purpose digital, analog, mixed-signal, wireless, and power instrumentation, the Diamondx is a well established leader in touch controller test. With the addition of the PD2x display driver digitizer instrument and the HSI1x 12.8Gbps SerDes test instrument, the Diamondx platform enables our customers to push the boundaries of performance, quality and cost-effectiveness of their TDDI products.”
About Xcerra
Xcerra is comprised of two reporting segments; Semiconductor Test Solutions (STS) and Electronics Manufacturing Solutions (EMS). The STS segment supplies semiconductor testers, test handlers, device contactors and associated services. The EMS segment offers products and services for PCB and PCBA test as well as innovative and highly reliable interconnect components for electronic manufacturing. The combination of these businesses creates a Company with a broad spectrum of semiconductor and PCB test expertise that drive innovative new products and services, and the ability to deliver to customers fully integrated semiconductor test cell solutions. The Company’s products and services address the broad and divergent requirements of the mobility, automotive, industrial and consumer end markets, offering a comprehensive portfolio of solutions and technologies, and a global network of strategically deployed applications and support resources.
Suggested Items
TRI to Exhibit at SMTA Queretaro Expo 2025
07/16/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, is pleased to announce plans to exhibit at the SMTA Querétaro Expo 2025, scheduled to take place on July 24, 2025, at the Querétaro Centro de Congresos y Teatro Metropolitano.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design
07/16/2025 | I-Connect007In this special Meet the Author episode of the On the Line with… podcast, Nolan Johnson sits down with Martyn Gaudion, signal integrity expert, managing director of Polar Instruments, and three-time author in I-Connect007’s popular The Printed Circuit Designer’s Guide to... series.
TTCI Joins Printed Circuit Engineering Association to Strengthen Design-to-Test Collaboration and Workforce Development
07/09/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its membership in the Printed Circuit Engineering Association (PCEA), further expanding the company’s efforts to support cross-functional collaboration, industry standards, and technical education in the printed circuit design and manufacturing community.
Study on Resonance Mitigation in Metallic Shielding for Integrated Circuits
07/08/2025 | Maria Cuesta-Martin, Victor Martinez, Vidal Gonzalez Aguado, Würth ElektronikInherent cavity resonant modes often lead to significant degradation of shielding effectiveness, responsible for unwanted electromagnetic coupling. Cavity resonant modes of the metal shielding enclosure can produce two adverse problems: the mutual coupling among different RF modules and shielding effectiveness reduction of the metal enclosure. The cabinets serve to shield certain components from electromagnetic interference (EMI). However, these cavities present some resonance peaks at 5 GHz, making it impossible to use them at higher frequencies.