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ABF Substrate Supply Becomes Tight
September 28, 2018 | DigitimesEstimated reading time: Less than a minute
The supply of ABF (ajinomoto build-up film) substrates has become tight, thanks to growing demand for server and high-performance computing applications, according to Digitimes.
Over the past several years, IC substrate suppliers were cautious about capacity expansion given the stagnant PC market, as well as a lack of breakthrough in server technology. However, the arrival of big data analytics has been stimulating demand for solutions, such as ABF substrates, needed for more complex IC designs.
Unimicron Technology has already seen its supply of ABF substrates fall short of demand, Digitimes reports. Unimicron's tight supply has prompted the substrate maker's major clients, such as AMD, to shift orders to other substrate suppliers including Nan Ya Printed Circuit Board (NPC) and Kinsus Interconnect Technology.
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AT&S Advances Glass Core Substrates for AI, HPC, and Photonics
04/22/2026 | AT&SAT&S is advancing glass core substrates from research toward industrial use in artificial intelligence, high-performance computing, high-speed communications and photonics.
EDIP Opens the Door: EU Funding Now Available for Defence Electronics Including PCBs and Substrates
04/21/2026 | Alison James and Chris Mitchell, Global Electronics AssociationThe European Commission has published a call for proposals under the European Defence Industry Programme (EDIP), and for European electronics manufacturers the message is clear: this is real money for real capacity, and PCBs and IC substrates are explicitly in scope. EDIP's Industrial Reinforcement Actions (IRA) dedicate €122.25 million to key electronic components, covering guidance electronics, propulsion electronics, RF and laser modules, multispectral cameras, avionics, PCBs and IC substrates, lithium-ion polymer batteries, power electronics, and critical semiconductor building blocks
Long Night of Research 2026: AT&S Brings Artificial Intelligence to Life
04/15/2026 | AT&SWhen the Long Night of Research takes place throughout Austria on Friday, April 24, setting an example for the country’s innovative strength, AT&S will be there with a special highlight.
Zhen Ding Achieves Record Revenue in 2025 with Both GM and OPM Expanding
03/16/2026 | Zhen DingZhen Ding Technology Holding Limited, a global leading PCB manufacturer, held an investor conference and announced its consolidated financial results for the full year of 2025.
IC Substrates vs. UHDI: The Future of Interconnect
03/15/2026 | Marcy LaRont, I-Connect007Advanced packaging is driving feature sizes below 50 microns, forcing IC substrates and UHDI PCBs into overlapping territory. Following his presentation at the Pan-European Design Conference (PEDC) in January, Jan Pedersen, director of technology at NCAB Group, spoke with us about how heterogeneous integration, evolving HDI roadmaps, and supply chain pressures are shaping the next phase of advanced packaging.