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Power Delivery, AI Infrastructure, and Materials Innovation: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

07/14/2026 | I-Connect007 Editorial Team
The upcoming issue of Advanced Electronics Packaging Digest examines three areas where packaging technology is increasingly defining system performance: power delivery for AI accelerators, the rapid expansion of AI data centers, and the growing importance of substrate materials in high-reliability electronics. Together, these features explore how packaging decisions influence performance, reliability, and long-term scalability across the electronics ecosystem.

Sumitomo Chemical Subsidiary to Establish of a Joint Venture with Samsung Electro-Mechanics for the Glass Core Substrate Business

07/13/2026 | Sumitomo Chemical
Sumitomo Chemical today announced that its wholly owned Korean subsidiary, Dongwoo Fine-Chem Co., Ltd. , has signed a joint venture agreement with Samsung Electro-Mechanics Co., Ltd. to establish a joint venture company that will engage in the business of glass core substrates for advanced semiconductor packages.

ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging

07/07/2026 | BUSINESS WIRE
Advanced Chip and Circuit Materials (ACCM) introduced Celeritas SMC (Silicon-Matched Core), a production-ready core for advanced IC substrates engineered to match the in-plane coefficient of thermal expansion of silicon while running on established organic-substrate manufacturing lines.

A Case Study in Conquering High Aspect Ratio Features

07/06/2026 | Richard Nichols, GreenSource Engineering
As demand for high-performance electronics is further driven by advances in AI and machine learning, the importance of high aspect ratio (HAR) through-holes in PCBs and IC substrates has become increasingly apparent. These vias play a vital role in enabling vertical interconnections in complex circuit architectures, especially within HDI structures, where maximizing space and enhancing electrical performance are crucial.

Technica USA Receives Recognition at PCBAA Annual Meeting

06/24/2026 | Technica USA
chnica USA joined fellow members of the Printed Circuit Board Association of America (PCBAA) in Washington, D.C., for the Association’s Annual Meeting and advocacy events on Capitol Hill.
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