Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

AT&S Advances Glass Core Substrates for AI, HPC, and Photonics

04/22/2026 | AT&S
AT&S is advancing glass core substrates from research toward industrial use in artificial intelligence, high-performance computing, high-speed communications and photonics.

EDIP Opens the Door: EU Funding Now Available for Defence Electronics Including PCBs and Substrates

04/21/2026 | Alison James and Chris Mitchell, Global Electronics Association
The European Commission has published a call for proposals under the European Defence Industry Programme (EDIP), and for European electronics manufacturers the message is clear: this is real money for real capacity, and PCBs and IC substrates are explicitly in scope. EDIP's Industrial Reinforcement Actions (IRA) dedicate €122.25 million to key electronic components, covering guidance electronics, propulsion electronics, RF and laser modules, multispectral cameras, avionics, PCBs and IC substrates, lithium-ion polymer batteries, power electronics, and critical semiconductor building blocks

Long Night of Research 2026: AT&S Brings Artificial Intelligence to Life

04/15/2026 | AT&S
When the Long Night of Research takes place throughout Austria on Friday, April 24, setting an example for the country’s innovative strength, AT&S will be there with a special highlight.

IC Substrates vs. UHDI: The Future of Interconnect

03/15/2026 | Marcy LaRont, I-Connect007
Advanced packaging is driving feature sizes below 50 microns, forcing IC substrates and UHDI PCBs into overlapping territory. Following his presentation at the Pan-European Design Conference (PEDC) in January, Jan Pedersen, director of technology at NCAB Group, spoke with us about how heterogeneous integration, evolving HDI roadmaps, and supply chain pressures are shaping the next phase of advanced packaging.

UHDI, AI, and RF Materials: Signals From the Next Phase of Advanced Packaging

03/11/2026 | I-Connect007
The upcoming issue of Advanced Electronics Packaging Digest explores several developments shaping the future of advanced electronics, from the convergence of IC substrates and ultra-high-density interconnect (UHDI) PCBs to the growing influence of artificial intelligence on semiconductor packaging and the materials science behind high-frequency system performance.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in