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Mentor Webinar: What's New in VX2.4
October 3, 2018 | Mentor, a Siemens businessEstimated reading time: Less than a minute
Mentor, as Siemens business will hold the "What's New in VX2.4 for PADS Professional & Xpedition" webinar on October 4, 2018, at 8:30 a.m. to 9:30 a.m. US/Pacific.
Each version of Xpedition and PADS Professional adds additional features and provides bug fixes. Attend this webinar to learn how to leverage these new features. Quickly find out what you will gain by moving to the newest version.
About the Presenter
Kyle Lake is an Applications Engineer for Oasis Sales. Before joining Oasis, Kyle was a Corporate Marketing Engineer at Mentor Graphics where he was responsible for helping customers identify solutions to their PCB design issues.
His primary focus at Oasis is supporting advanced solutions: PADS Professional, the Xpedition Enterprise Platform and PCB simulation tools for high-performance designs.
For more information, click here.
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Marcy’s Musings: Advancing the Advanced Materials Discussion
09/17/2025 | Marcy LaRont -- Column: Marcy's MusingsAs the industry’s most trusted global source of original content about the electronics supply chain, we continually ask you about your concerns, what you care about, and what you most want to learn about. Your responses are insightful and valuable. Thank you for caring enough to provide useful feedback and engage in dialogue.
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Element Solutions Declares Q3 Dividend of $0.08 Per Share
08/22/2025 | BUSINESS WIREElement Solutions Inc announced that its board has declared a quarterly cash dividend of $0.08 per share of the company's common stock. The declared dividend will be paid on September 15, 2025 to stockholders of record as of the close of business on September 2, 2025.
Polymatech Electronics Limited Announces Completion of PCB Manufacturing Facility in Europe
08/15/2025 | PR NewswirePolymatech Electronics Limited is thrilled to announce the successful commissioning of its state-of-the-art Printed Circuit Board (PCB) manufacturing facility in Estonia, Europe. This milestone represents a significant advancement in the company's strategic expansion across the European market.