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AltiumLive 2018 a Mecca for PCB Designers
October 8, 2018 | Barry Matties, I-Connect007Estimated reading time: 3 minutes
After the classes on the first day wrapped up, Altium held a Happy (Holden) Happy hour. This special event took place on the outdoor patio where Happy Holden held a book signing of his HDI Handbook and introduced his latest book on automation, Automation and Advanced Procedures in PCB Fabrication.
The second day began with an overview of the new Altium 365 tool. This tool will give designers the ability to easily collaborate with their team in real time. The tool also has a companion app that provides a mobile experience, so designers can enjoy instant access to their projects anywhere in the world. A key driver behind Altium 365 is convenience, an important attribute that the Altium team strives for in each tool update. They want their user experience to be as convenient as possible.
The second day was also filled with great keynote speakers who inspired the group with their ideas and accomplishments. Between the keynotes, the attendees enjoyed their breaks with refreshments and visits to the tabletop exhibits of the event sponsors.
The sponsors’ tabletops displays included exhibits from PCB design services and fabrication providers, OEMs, and of course the I-Connect007 tabletop. There was also a special Altium user experiences room that allowed attendees to meet the Altium team and have a hands-on look at the suite of offerings provided by Altium.
Once day two’s educational tracks came to a close, a cocktail party began on the beautiful patio and tabletop exhibit area.
The crowed was energized and sharing what they learned and looking forward to another great meal.
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Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.