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Ventec’s Martin Cotton Retires
October 10, 2018 | Ventec International GroupEstimated reading time: 2 minutes
Ventec International Group Co., Ltd. announced the retirement of Martin Cotton, director OEM Projects.
Cotton’s career spans over 51 years, with 45 spent in the printed circuit board industry. After much consideration and careful planning, Martin announced his retirement at the end of September 2018 and will be gradually working his way out of the company by the end of the year.
Cotton joined Ventec International Group in 2013 as global director OEM technology marketing and, together with his team of global account managers, set out to raise Ventec’s brand and product awareness amongst blue ribbon “tech” companies around the world. In 2017 Martin accepted the position of director OEM projects which was created to focus on customer specific projects.
Cotton will be retiring from full-time employment to concentrate on commercializing his many patents.
“Ventec was always going to be the last great adventure for me in the PCB world, and it has proven so. Working in materials for these past five years has been an excellent experience, and I wish I had found it earlier in my career, or at least I wish that Mark Goodwin had found me earlier,” said Cotton.
“I would like to thank Martin, my colleague and friend, for his contribution to the company. He will be missed by the entire Ventec team and we all wish him the very best and a very happy retirement,” said Mark Goodwin, COO Europe and Americas.
About Ventec International Group
With volume manufacturing facilities and Headquarters in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
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