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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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October 2018 Edition of PCB007 Magazine Now Available
October 11, 2018 | I-Connect007Estimated reading time: Less than a minute

GreenSource Fabrication, a New Hampshire division of Whelen Engineering, is rolling out an expanded facility that can claim to be the most advanced automated PCB facility in North America. It’s also zero waste and zero effluent.
The October edition of PCB007 Magazine features a detailed tour of the facility, and discussions with the designers, staff and equipment suppliers collaborating to make this factory a reality.
Check out how GreenSource Fabrication is redefining automation in this month's issue of PCB007 Magazine, now on the virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.
For future reference, be sure to download the PDF version.
Suggested Items
Real Time with... IPC APEX EXPO 2025: GreenSource's Growth and Future Developments
04/15/2025 | Real Time with...IPC APEX EXPOThings are looking bright for GreenSource. Michael Gleason shares an update on GreenSource's recent growth and upcoming changes. A recipient of a Defense Production Act Investment Program award, GreenSource is planning for new substrate capabilities. Current investments continue to enhance equipment and sustainability initiatives such as water quality. And their unique collaboration with the University of New Hampshire continues to aid their workforce development, despite recruitment challenges.
D Coupon Testing and Data Insights With GreenSource Fabrication
04/17/2024 | Marcy LaRont, PCB007 MagazineMarcy LaRont spoke with Steve Karas of GreenSource Fabrication at the SMTA UHDI conference in March. He presented a case study that GreenSource undertook with a customer on critical via reliability with advanced materials and used the experience to highlight the importance and effectiveness of D coupon testing. He also discussed GreenSource’s approach to data aggregation and a new system they developed to use collected data effectively.
DOD Awards $46.2 Million to Revitalize the U.S. Defense Industrial Base On-Shoring of Advanced Packaging and Assembly
12/22/2023 | U.S. Department of DefenseThe Department of Defense announced an award of $46.2 million to GreenSource Fabrication LLC (GreenSource) via the Defense Production Act Investment (DPAI) Program. The award will enhance existing production capabilities at a manufacturing facility of state-of-the-art integrated circuits (IC) substrate, high-density interconnect (HDI) and ultra-high-density interconnect (UHDI), and advanced packaging.
DOD Awards $46.2 Million to Revitalize the U.S. Defense Industrial Base On-Shoring of Advanced Packaging and Assembly
12/22/2023 | U.S. DoDThe Department of Defense announced an award of $46.2 million to GreenSource Fabrication LLC (GreenSource) via the Defense Production Act Investment (DPAI) Program.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/06/2023 | Nolan Johnson, I-Connect007This week, our must-read picks include the PCB industry monthly report, IPC’s Alison James’ statement to the EU regarding the vitality of our industry, an overview of test and inspection, greenfield fabrication facility design, and the future of advanced packaging and solder.