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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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EIPC SpeedNews: News from the European PCB Industry
November 28, 2018 | EIPCEstimated reading time: 1 minute
- Reducing Manufacturing Costs Through Upscaling Panel Size for Copper Plating on Fan-Out Panel-Level Packaging (FO-PLP)
- Technolam Appoints Roland Schönholz as Technical Marketing Manager
- Atotech's Surface Finish Specialist Rick Nichols a Presenter and Panelist at SMTA International 2018
- New eBook Promotes Automation and Advanced Procedures in PCB Fabrication
- Shortages & Price Hikes Leave Supply Chain in Disarray
- Analysts Foresee Supply Chain Impact from Chip Hack Report
- Seica Publishes Video on New Compact Slim Next> Series
- Smart Systems Integration Barcelona, Spain, April 10–11, 2019
- Dyconex to Exhibit at electronica 2018 and expoAIR
- Ventec International Group's Martin Cotton Retires
- pOp 2: The 2nd International Conference on Photonics & Optoelectronics Packaging
- Polar October News - Limitless Drill Documentation / electronica
- Aegis Software and Inovaxe Partner to Deliver Integrated MES and Material Handling & Storage Solution for Ultra-Lean Manufacturing
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Simon Khesin - Schmoll MaschinenSuggested Items
Ventec Evaluates US Manufacturing Facility to Support North American Growth
04/28/2026 | Ventec International GroupVentec International Group today announced that it is evaluating the potential establishment of a manufacturing facility in the United States to support its growing North American customer base with high-performance laminate and prepreg materials.
Ventec Expands Manufacturing Footprint with New Thailand Facility Supporting “China + Taiwan Plus One” Supply Chains
03/12/2026 | Ventec International GroupVentec International Group today provided an update on the progress of its new manufacturing facility in Thailand, which is scheduled to come on stream in Q2 2026, marking an important step in the company’s strategy to diversify global production and support customers seeking China & Taiwan plus one supply chain resilience.
Inventec Enhances Server and Notebook Design for Manufacturing Excellence with Siemens’ Software
03/03/2026 | SiemensSiemens announced Inventec Corporation, a global leader in high-tech electronics and server manufacturing, has adopted Siemens’ Valor™ NPI software and Process Preparation X solutions from the Siemens Xcelerator portfolio to strengthen design-for-manufacturing (DFM) efficiency and production quality across its server and notebook product lines.
Volker Klafki Joins Ventec as Senior Technical Engineer for EMEA
02/04/2026 | VentecVentec International Group is delighted to announce the appointment of Volker Klafki as Senior Technical Engineer for EMEA.
Ventec International Group Partners with Taoyuan Stone Weir Association on 'Ocean Stone Weir Conservation Project'
11/10/2025 | Ventec International GroupVentec International Group announced its strategic partnership with the Taoyuan Stone Weir Association to launch the “Ocean Stone Weir Conservation Project,” aimed at preserving Taiwan’s unique stone weir heritage and enhancing marine ecological awareness.