The Marketing Minute: If Your Marketing Budget Gets Cut in Half, Then What?
Punching Out: How Are the Big Boys in Electronics Doing?
It’s Only Common Sense: Complexity Is the Enemy of Profit
IPC Europe Forum Call for Papers: Innovation for Reliability
October 30, 2018 | IPCEstimated reading time: 1 minute
IPC is seeking presentations for its 3rd Annual High Reliability Forum for Electronics Subjected to Harsh Use Environments. IPC is interested in presentations on the following topics:
- Mechanical stress reliability — vibration and shock Methods (software) for predicting reliability
- Failure Modes Effects Analysis (FMEA)
- Thermal Mitigation
- Thermal Stress Test Methods
- HDI Reliability
- Microvia Failures and Testing Methods
- Microvia Reliability
- Design for Reliability
- Design Rules for Spacing and Staggered Vias
- Failures Related to Laminate Materials
- Materials Compatibility
- System-level effects on Solder Joint Reliability
- Assembly Tests for Solder Joint Reliability
Presentations should be noncommercial and describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. Presentations should be 45 minutes, including time for questions and answers.
Staff from companies such as NASA Goddard Space Flight Center, Honeywell Aerospace, Lockheed Martin Missiles and Fire Control, Motorola and Raytheon have presented papers at past IPC High Reliability Forums.
If you’re interested in presenting at this important industry event, please submit a brief abstract along with the title of your presentation to AliciaBalonek@ipc.org.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.
KYZEN to Focus on Aqueous and Stencil Cleaning Solutions at SMTA Juarez Expo and Tech Forum
05/12/2026 | KYZENKYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, May 21 at Injectronics Convention Center in Ciudad Juarez, Chihuahua.
Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components
05/13/2026 | Nash Bell -- Column: Knocking Down the Bone PileUnderfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces.
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.