Taking the Edge off of Nanoscale Heat
November 5, 2018 | A*STAREstimated reading time: 2 minutes

Black phosphorene, an unusual two-dimensional (2D) compound, may offer strategies for avoiding damaging hot spots in nanoscale circuits, a new study from A*STAR researchers1 has revealed.
While carbon atoms in graphene films sit perfectly flat on a surface, black phosphorene has a distinct wrinkled shape due to the bonding preferences of its phosphorus atoms. Investigations suggest that the zig-zag structure of this 2D film enables it to behave differently in different orientations: it can transport electrons slowly along one axis, for example, but rapidly in the perpendicular direction.
Xiangjun Liu, from the A*STAR Institute of High Performance Computing notes that black phosphorene’s capabilities stretch beyond high-speed electronics. “It has optical, mechanical, and thermal properties that all exhibit directional dependence,” he says. “This stems from the unique puckered structure, which really impressed me when I first saw it.”
Researchers theorize that excess heat could be drawn from nanoscale circuits using precisely controlled phonons — 'quanta' or packets of vibrational energy — present in black phosphorene components.
Liu and co-workers focused their study on an important structural issue that can affect phosphorene thermal conductivity — the atom structures at the edges of the 2D film. Researchers have predicted that phosphorene may either have a dimer edge formed by coupling of two terminal atoms, or an energetically stable tube-shaped edge created by multi-atom bonding.
To understand how different edge structures impact thermal conductivity, the A*STAR team used computer algorithms that simulate phonon transfer across a temperature gradient. They modeled phosphorene films as narrow, rectangular nanoribbons and observed that heat conductivity was mostly uniform in pristine nanoribbons. The dimer and tube-terminated models, on the other hand, preferred to direct heat to central regions away from the edges.
Further calculations revealed that the tube-edged models produced different phonon excitations from the other phosphorene structures — they exhibited a new type of twisting movement, as well as geometric expansions and contractions referred to as breathing modes. These additional movements, explains Liu, are probably why tube edges work so well in scattering thermal vibrations and remaining cool.
Normally, 2D materials have reduced ability to diffuse heat when strained laterally. Tube-terminated nanoribbons, however, have nearly constant thermal conductivity under strain — a property that may be useful in future wearable technology.
“The strain-independent thermal behavior could benefit devices that need stable performance while being strained or twisted,” says Liu. “Phosphorene has great potential for applications of soft and flexible electronics.”
Suggested Items
TRI to Unveil New High-Throughput AOI and AXI at productronica 2023
09/15/2023 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join productronica 2023, which will be held at Messe München Center from November 14 – 17, 2023.
UK Space Agency Launches Consultation on Variable Liability Limits for Orbital Operations
09/15/2023 | UK Space AgencyThe proposals from the UK Space Agency follow a review into the UK’s approach to setting the amount of an operator’s liability in licences for orbital operations, a key commitment of the government’s National Space Strategy.
MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024
09/14/2023 | MediaTekMediaTek and TSMC announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year.
MKS’ Atotech to Participate in IPCA Expo 2023
09/14/2023 | MKS’ AtotechMKS’ Atotech, a leading surface finishing brand of MKS Instruments, will participate in the upcoming IPCA Expo at Bangalore International Exhibition Centre (BIEC) and showcase its latest PCB manufacturing solutions from September 13 – 15.
Comtech Unveils New BRIDGE Solutions to Increase Access to Global Hybrid Connectivity
09/12/2023 | Business WireComtech launched its new blended, resilient, integrated, digital, global, end-to-end (BRIDGE) connectivity solutions. Comtech’s BRIDGE solutions provide portable, adaptable, full-service communications networks that can be established in a matter of hours and help “bridge the gap” for traditional satellite and terrestrial infrastructures.