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Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
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IPC APEX EXPO Executive Forum Focuses on Auto Electronics
November 15, 2018 | IPCEstimated reading time: 1 minute
Senior-level executives from across the global electronics industry supply chain will gather to discuss challenges and opportunities of the burgeoning and rapidly changing automotive electronics industry during the IPC Executive Forum on Advancing Automotive Electronics at IPC APEX EXPO 2019. Presented by IPC’s Hall of Fame Council on January 28, the forum will focus on automotive electronics costs, reliability and programs from concept to production.
The Forum will include speakers from the United States, Asia and Europe to join the discussion on the challenges and opportunities for IPC and the electronics industry. Speakers include representatives from MacDermid-Enthone, Microtek Labs China, Elga Europe, Robert Bosch GmbH Germany, Nexteer Automotive, APTIV, Optimal+ and Ventec International Group.
“As the automotive industry increasingly incorporates electronics into its manufacturing, this provides a unique opportunity for IPC and our members to participate in this continually evolving field,” said Gene Weiner, Executive Forum program chair. “This Forum provides us with a chance to hear from subject matter experts about the many ways for involvement of our industry in automotive electronics.”
Topics will include materials in automotive electronic packaging, PCB reliability testing for automotive electronics, developing film photoresist to meet automotive fine line circuit needs, cost models with suppliers and understanding costs of new technology, developing and getting approval of new material for automotive electronics.
“We are thrilled that the Hall of Fame Council has put together such an important event for our members’ executives,” said Sanjay Huprikar, vice president of Solutions at IPC. “Following our June Automotive Electronics Forum in Nuremberg and the September launch of our new Reliability Council in Frankfurt, this upcoming event in January at IPC APEX EXPO directly supports IPC’s efforts to engage heavily with the transportation vertical.”
Information and registration for the Executive Forum on Advancing Automotive Electronics is available online, click here.
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