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RUAG and Elbit Systems to Form Swiss Joint Venture
November 26, 2018 | RUAGEstimated reading time: 1 minute
RUAG and Elbit Systems announced today that they have signed a memorandum of understanding (MOU) to form a joint venture company (JVC). The two companies will establish this entity in Switzerland, under a joint team comprised of professionals from both companies who have already begun to work in collaboration.
The JVC will enable the companies to synergize and leverage their respective competences and serve as a national communication and system competence center of excellence. The Competence Center will cater to the needs and requirements of the Swiss Federal Department of Defence, Civil Protection and Sport (DDPS). Furthermore, it will act as a knowledge center to support the companies’ joint efforts with regard to a DDPS’ communication program of the Ministry of Defense of Switzerland (Swiss MOD) and other joint endeavors in the future.
“We at RUAG Defence are looking forward to working with Elbit Systems and we are convinced that this collaboration will allow us to support the Swiss Army with our proven competence and professionalism,” said Andreas Berger, CEO RUAG Defence.
“It is a privilege to be in a position to offer technologically advanced and operational solutions for the Swiss Armed Forces. We are proud to join forces with RUAG and believe that this collaboration will strengthen local support and engineering capabilities through transfer of knowhow,” said Haim Delmar, senior vice president Elbit Systems C4I & Cyber.
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Julia McCaffrey - NCAB GroupSuggested Items
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
The Power Shift in U.S. Manufacturing Ownership
08/20/2025 | Nolan Johnson, I-Connect007The U.S. manufacturing landscape is driven by reshoring initiatives, supply chain realignments, and a surge of foreign interest. What does that mean for U.S.-based PCB and EMS companies? In this interview, mergers and acquisitions expert Tom Kastner breaks down the forces reshaping the industry—why foreign investors are eager to enter the U.S. market, why many are evaluating greenfield facilities over acquisitions, and why the high-mix, low-volume focus of most domestic shops doesn’t always align with foreign buyers’ goals.
Facing the Future: Challenges and Opportunities in Reshoring PCB Manufacturing
08/12/2025 | Prashant Patel -- Column: Facing the FutureFor decades, offshore manufacturing dominated the global electronics industry. The pursuit of cost efficiency, scalability, and access to vast labor markets made countries like China, Taiwan, and Vietnam attractive destinations for printed circuit board (PCB) production. But a seismic shift is underway, from geopolitical instability and supply chain disruptions to rising labor costs and national security concerns.
Hon Hai Technology Group (Foxconn) and TECO Announce Strategic Alliance Targeting AI Data Center Capabilities
07/31/2025 | Hon Hai Technology GroupHon Hai Technology Group (“Foxconn”) and TECO Electric & Machinery Co Ltd (“TECO”) on Wednesday announced a share exchange, strategic alliance that will strengthen their AI infrastructure capabilities and propel the two Taiwanese tech majors into key markets in the global super-computing race.
Direct Metallization: A Sustainable Shift in PCB Fabrication
07/31/2025 | Jim Watkowski, Harry Yang, and Mark Edwards, MacDermid Alpha Electronics SolutionsThe global electronics industry is undergoing a significant transformation, driven by the need for more resilient supply chains and environmentally sustainable manufacturing practices. Printed circuit boards (PCBs), the backbone of interconnection for electronic devices, are at the center of this shift. Traditionally, PCB fabrication has relied heavily on electroless copper, a process that, while effective, is resource-intensive and environmentally hazardous. In response, many manufacturers are turning to direct metallization technologies as a cleaner, more efficient alternative.