Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Tech Brief Helps Make Critical Thin Film Manufacturing Decision
November 27, 2018 | Tech BriefEstimated reading time: 1 minute
SemiGen, Inc. an ISO and ITAR registered provider of RF and microwave contract assembly, foundry services, semiconductor devices, and RF supplies has released a technical brief detailing the advantages to RF/microwave circuit designers of manufacturing their circuits using ion beam milling over chemical etching.
This tech brief describes manufacturing thin film circuits using a next-generation anisotropic ion beam milling process that is proving to be the most precise, repeatable, and clean approach over the more random process of traditional material subtraction via chemical etching.
The brief describes experiments conducted by the former Ion Beam Milling, Inc. technical team (now SemiGen) that thoroughly examined the degree of variation in performance of two RF filter circuit designs, one at 12 GHz and the other at 24 GHz. Each were produced via the two processes. The information will provide microwave/millimeter-wave circuit, component, and subsystem engineers a baseline for committing to an intended thin film process and details the key advantages of uniformity and repeatability of trace walls using ion beam milling―particularly at higher frequencies.
The brief makes a strong argument that the ion beam milling process produces such precise and repeatable thin film circuits that it be committed to for all thin film circuits to improve design for manufacturability (DFM) expertise of engineering teams, while improving performance and yields for all products long term. This is especially true for circuit designers who work consistently above 1 GHz. The degree of performance improvement is tied to a variety of factors, including the complexity of the circuit design, feature size, and proximity of trace lines.
About SemiGen
SemiGen is an RF/microwave solutions company that provides manufacturing services and products to OEMs looking to fill critical voids in their production department and supply chain. Services include hybrid assembly, high frequency testing, up-screening, and foundry options. Products include diodes, semiconductors, and thin film circuits, as well as name brand bonding supplies. Combining decades of experience with a state-of-the-art facility and foundry, they help OEMs become efficient in meeting demands for consistent, reliable delivery of their high performance electronic devices.
Share on:
Suggested Items
SMT007 Magazine July—What’s Your Competitive Sweet Spot?
07/01/2025 | I-Connect007 Editorial TeamAre you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche—what are their insights? In the July 2025 issue of SMT007 Magazine, we spotlight companies thriving by redefining or reinforcing their niche and offer insights to help you evaluate your own.
Smarter Machines Use AOI to Transform PCB Inspections
06/30/2025 | Marcy LaRont, PCB007 MagazineAs automated optical inspection (AOI) evolves from traditional end-of-process inspections to proactive, in-line solutions, the integration of AI and machine learning is revolutionizing defect reduction and enhancing yields, marking a pivotal shift in how quality is managed in manufacturing.
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.