-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Intelligent Framework Aims To Optimize Data Transfer in 5G Networks
November 29, 2018 | North Carolina State UniversityEstimated reading time: 1 minute

A North Carolina State University researcher has developed technology designed to allow cellular communication nodes in 5G systems to partition bandwidth more efficiently in order to improve end-to-end data transmission rates. In simulations, the tech is capable of meeting the international goal of 10 gigabits per second in peak performance areas.
“End-to-end transfer means that the technology accounts for all of the connections between a data source and the end user,” says Shih-Chun Lin, an assistant professor of electrical and computer engineering at NC State and author of a paper on the work.
“My technology, incorporating both hardware and software, is a framework that takes into account data transfer rates, wired and wireless bandwidth availability, and the power of base stations—or eNodeBs—in a 5G network,” Lin says. “It then uses stochastic optimization modeling to determine the most efficient means of transferring and retrieving data—and it does this very quickly, without using a lot of computing power.”
Lin says that simulation testing of the framework is promising, and he and his research team are in the process of building a fully functional prototype.
“The prototype will allow us to conduct tests on a 5G testbed platform, since full-scale 5G networks are not yet online,” Lin says. “But simulation results suggest that we’ll be able to meet the 3GPP goal of 10 gigabits per second data transfer in peak coverage areas.
“We are currently seeking industry partners to work with us on developing, testing and deploying the framework to better characterize its performance prior to widespread adoption of 5G networks,” Lin says.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.