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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Cascade Chapter of IPC Designers Council Meets Dec. 7
November 29, 2018 | IPC Designers Council, Cascade ChapterEstimated reading time: 2 minutes
The Cascade Chapter of the Designers Council's next Lunch and Learn meeting will take place December 7 at the Lake Washington Institute of Technology-Kirkland Campus (LWIT).
This meeting we will cover flex fabrication, materials, and techniques as well as some do's and don'ts. Jerome Larez, an application engineer with MicroConnex, will be the guest speaker for this event.
With the ever-increasing emphasis on IoT (Internet Of Things), the demand for flex circuits and designs is increasing rapidly. This will be an opportunity to get helpful insights into flex fabrication and learn how to avoid some common errors made by flex designers.
Following the meeting, there will be Altium User Group meeting for anyone who is interested. Stop by and become part of the conversation as Product Marketing Engineer David Haboud meets with local users and other industry advocates to discuss some of the toughest “how to” and “why” questions surrounding Altium Designer and the PCB design industry.
Presentation: Flex Printed Circuit Fabrication
Speaker Jerome Larez will focus on flex printed circuit (FPC) fabrication. He will be discussing common materials used in FPC fabrication, including stiffeners and coverlays. Jerome will outline FPC fabrication techniques, how to better communicate your design requirements to fabricators, and some of the do’s and don’ts for FPC design.
Reserve a spot on your calendar on Friday, December 7 from 11:30 am to 1:30 pm for this educational Lunch and Learn event. The cost is $20 to cover the cost of lunch.
Location
Lake Washington Institute of Technology-Kirkland Campus
Room A102 (in the southeast corner of the building, on the 1st floor)
11605 132nd Ave NE
Kirkland, Washington 98034
CID+ Class Rescheduled
There has been a change in the scheduling for the upcoming CID+ Class that had been scheduled for November 13-16. It has now been rescheduled for December 4-7, 2018, so be sure to sign up if you are interested in taking this advanced certification course, which will be at the same college as the upcoming chapter meeting, LWIT.
Also be sure to follow industry related magazines such as Design007 Magazine. The links to these sites can be found on our chapter web site: http://cascade-ipcdc.org
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Rachael Temple - AlltematedSuggested Items
When Quality Is Personal: The Human Stakes Behind Electronics Reliability
05/06/2026 | Kelly DackIn electronics manufacturing, quality is often discussed in terms of specifications, standards, and process controls, but as industry veteran Doug Pauls reminds us, the stakes are far more human. In this conversation, Doug, a recipient of the Global Electronics Association’s Hall of Fame Award, draws on more than four decades of experience to illuminate the real-world consequences of reliability, where even a single defect can carry profound implications. He brings into sharp focus why quality isn’t just a metric, but a responsibility shared by everyone on the manufacturing floor.
PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary
05/05/2026 | Marcy LaRont, I-Connect007Throughout most of the 20th century, manufacturing was central to the American Dream of providing stable jobs and pathways to upward mobility. Today, more than 80% of global electronics manufacturing capacity resides in China and greater Asia, raising serious concerns about supply chain resilience and national security.
India’s Vasantha Advanced Systems: EMS Success for 30 Years
04/22/2026 | Marcy LaRont, I-Connect007Based in one of India’s premier manufacturing regions, Vasantha Advanced Systems is an EMS provider that has built a reputation for quality, reliability, and long-term customer partnerships, earning repeated recognition from the Indian government through its National MSME Awards. Now, with a full spectrum of capabilities spanning PCB assembly, box build, and wire harness, and a workforce of more than 500, Vasantha is expanding its presence into the U.S. market. At APEX EXPO, I met Dr. Chidambaranathan and learned how this rising global player is positioning itself to meet the evolving needs of North American customers.
April Issue of I-Connect007 Magazine: Beyond the Rulebook
04/14/2026 | I-Connect007 Editorial TeamIn this month’s I-Connect007 Magazine, we asked PCB designers, fabricators, and suppliers what it really means to operate without a rulebook. Their perspectives vary, especially between seasoned designers and experienced fabricators, but a common thread emerges: progress depends on pushing boundaries and finding a way forward, even when the path isn’t clear. In many ways, this mindset has always been part of what we do, whether we’ve called it that or not.
Defense Speak Interpreted: Hypersonics Report Back After Six Years of Silence
04/07/2026 | Dennis Fritz -- Column: Defense Speak InterpretedIt’s been six years since my Defense Speaks column about hypersonic weapons. Back then, these weapons were the most sought-after technology as there was little defense for them. They were the cornerstone of the “strike any location on earth within one hour” scenario. Of course, the war in Ukraine, and now the action in Iran, have grabbed the weapons headlines, but hypersonics still play a role and development continues. Here is the update.