Elementary, Mr. Watson: Design Data Packages—Circle of Concern or Circle of Influence?
Fresh PCB Concepts: The Power of a Lunch & Learn for PCB Professionals
The Shaughnessy Report: Solving the Data Package Puzzle
Cascade Chapter of IPC Designers Council Meets Dec. 7
November 29, 2018 | IPC Designers Council, Cascade ChapterEstimated reading time: 1 minute
The Cascade Chapter of the Designers Council's next Lunch and Learn meeting will take place December 7 at the Lake Washington Institute of Technology-Kirkland Campus (LWIT).
This meeting we will cover flex fabrication, materials, and techniques as well as some do's and don'ts. Jerome Larez, an application engineer with MicroConnex, will be the guest speaker for this event.
With the ever-increasing emphasis on IoT (Internet Of Things), the demand for flex circuits and designs is increasing rapidly. This will be an opportunity to get helpful insights into flex fabrication and learn how to avoid some common errors made by flex designers.
Following the meeting, there will be Altium User Group meeting for anyone who is interested. Stop by and become part of the conversation as Product Marketing Engineer David Haboud meets with local users and other industry advocates to discuss some of the toughest “how to” and “why” questions surrounding Altium Designer and the PCB design industry.
Presentation: Flex Printed Circuit Fabrication
Speaker Jerome Larez will focus on flex printed circuit (FPC) fabrication. He will be discussing common materials used in FPC fabrication, including stiffeners and coverlays. Jerome will outline FPC fabrication techniques, how to better communicate your design requirements to fabricators, and some of the do’s and don’ts for FPC design.
Reserve a spot on your calendar on Friday, December 7 from 11:30 am to 1:30 pm for this educational Lunch and Learn event. The cost is $20 to cover the cost of lunch.
Location
Lake Washington Institute of Technology-Kirkland Campus
Room A102 (in the southeast corner of the building, on the 1st floor)
11605 132nd Ave NE
Kirkland, Washington 98034
CID+ Class Rescheduled
There has been a change in the scheduling for the upcoming CID+ Class that had been scheduled for November 13-16. It has now been rescheduled for December 4-7, 2018, so be sure to sign up if you are interested in taking this advanced certification course, which will be at the same college as the upcoming chapter meeting, LWIT.
Also be sure to follow industry related magazines such as Design007 Magazine. The links to these sites can be found on our chapter web site: http://cascade-ipcdc.org
Share on:
Suggested Items
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Foxconn's Tiger Leap Combining Nature and Technology in Ecological Roof Garden
04/23/2025 | FoxconnHon Hai Technology Group, the world's largest technology manufacturing and service provider, has actively responded to the United Nations Sustainable Development Goals (SDGs).
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.
Bridging the Gap Between PCB Designers and Fabricators
04/03/2025 | Stephen V. Chavez, Siemens EDAWith today’s advanced EDA tools, designing complex PCBs in the virtual world does not necessarily mean they can be built in the real world. This makes the relationship between a PCB designer and a fabricator pivotal to the success of a project. In keeping with solid design for manufacturing (DFM) practices, clear and frequent communication is needed to dial and lock in design constraints that meet expectations while addressing manufacturing concerns.
Hitachi Announces Completion of New Production Facility for Semiconductor Manufacturing Equipment
04/01/2025 | JCN NewswireHitachi High-Tech Corporation announced that the new production facility for semiconductormanufacturing equipment (etch systems), which had been under construction since December 2023 in the Kasado area (Kudamatsu City, Yamaguchi Prefecture), was completed and started the operation on March 17, 2025.