Beyond Design: High-speed Rules of Thumb
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
The Shaughnessy Report: A Handy Look at Rules of Thumb
Cascade Chapter of IPC Designers Council Meets Dec. 7
November 29, 2018 | IPC Designers Council, Cascade ChapterEstimated reading time: 1 minute
The Cascade Chapter of the Designers Council's next Lunch and Learn meeting will take place December 7 at the Lake Washington Institute of Technology-Kirkland Campus (LWIT).
This meeting we will cover flex fabrication, materials, and techniques as well as some do's and don'ts. Jerome Larez, an application engineer with MicroConnex, will be the guest speaker for this event.
With the ever-increasing emphasis on IoT (Internet Of Things), the demand for flex circuits and designs is increasing rapidly. This will be an opportunity to get helpful insights into flex fabrication and learn how to avoid some common errors made by flex designers.
Following the meeting, there will be Altium User Group meeting for anyone who is interested. Stop by and become part of the conversation as Product Marketing Engineer David Haboud meets with local users and other industry advocates to discuss some of the toughest “how to” and “why” questions surrounding Altium Designer and the PCB design industry.
Presentation: Flex Printed Circuit Fabrication
Speaker Jerome Larez will focus on flex printed circuit (FPC) fabrication. He will be discussing common materials used in FPC fabrication, including stiffeners and coverlays. Jerome will outline FPC fabrication techniques, how to better communicate your design requirements to fabricators, and some of the do’s and don’ts for FPC design.
Reserve a spot on your calendar on Friday, December 7 from 11:30 am to 1:30 pm for this educational Lunch and Learn event. The cost is $20 to cover the cost of lunch.
Location
Lake Washington Institute of Technology-Kirkland Campus
Room A102 (in the southeast corner of the building, on the 1st floor)
11605 132nd Ave NE
Kirkland, Washington 98034
CID+ Class Rescheduled
There has been a change in the scheduling for the upcoming CID+ Class that had been scheduled for November 13-16. It has now been rescheduled for December 4-7, 2018, so be sure to sign up if you are interested in taking this advanced certification course, which will be at the same college as the upcoming chapter meeting, LWIT.
Also be sure to follow industry related magazines such as Design007 Magazine. The links to these sites can be found on our chapter web site: http://cascade-ipcdc.org
Share on:
Suggested Items
PI's New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times
11/20/2024 | PRNewswirePI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.
2024 Stromberg Student Leader Scholarship Recipient Announced
11/05/2024 | SMTASMTA is pleased to announce Waad Tarman, Auburn University, has been selected as the recipient of the 2024 JoAnn Stromberg Student Leader Scholarship.
Indium Announces InnoJoin as Exclusive Global Sales Partner for NanoFoil®
11/04/2024 | Indium CorporationIndium Corporation announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material that delivers energy in a controlled and precise manner for joining, energetics, and heating applications.
Flexible Thinking: Musings on High Density Interconnections
10/30/2024 | Joe Fjelstad -- Column: Flexible ThinkingPeople have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.